Choose a country or area to see content specific to your location
백서
Signal integrity (SI) addresses two key aspects of high-speed digital design: signal timing and quality. SI analysis ensures that signals reach their destination in good condition. For example, a system with good signal integrity has data that arrives early enough to meet timing requirements and to avoid false clocking (where a clock crosses a logic threshold more than once during a transition).
In a system, signals travel through various kinds of interconnections. For example, from chip to package, package to board trace, and trace to high-speed connectors. Signal integrity problems arise from the physical nature of the interconnecting wires. Unlike a connection line drawn on a schematic, a real wire has resistance, capacitance to ground and to other wires, and inductance. At higher frequencies, capacitance and inductance cause the wire to act as a transmission line. The resulting antenna effects result in crosstalk and electromagnetic interference (EMI).
Sufficiently significant signal-integrity problems cause systems to fail or work only intermittently, producing “bad” data. It is crucial to find signal integrity problems early in a design cycle. Intermittent failures are difficult to debug on prototypes.
콘텐츠 잠금 해제
무료 가입
*Indicates required field
감사합니다!
귀하의 양식이 성공적으로 제출되었습니다.
Note: Clearing your browser cache will reset your access. To regain access to the content, simply sign up again.
×
판매 문의 부탁드립니다.
*Indicates required field
감사합니다!
A sales representative will contact you soon.