High Node Count Fixturing Solutions for Test Fixtures

Application Notes

This paper discusses problems encountered in building large, high node count vacuum actuated test ixtures for the Keysight Technologies, Inc. Medalist In-circuit Test (ICT) family of board test systems. First is a discussion on the various problems that can occur in these applications followed by a description of two successful solutions that are recommended by Keysight. One of these solutions, the dual-plate method, is a new concept to many ixture builders and is described in some detail in this paper. The other solution, involving using a thicker probe plate, is straight-forward and requires little supporting explanation. In addition to the solutions discussed here, board test system users should also consider using mechanical ixturing solutions to deal with some of the problems discussed here. Mechanical ixturing will not eliminate probe plate bowing but it can be helpful in dealing with areas of dense probing. A variety of mechanical ixturing solutions for Keysight Medalist ICT ixturing applications are available from Keysight and from Keysight Channel Partners.

Large, high node count test ixtures often present special challenges for the ixture inisher. A problem that has become more common as probing densities increase and boards get larger is related to the upward lexing of the ixture’s probe plate. This lexing occurs when the ixture is pulled onto the system testhead and the system interface pins press upward against the bottom of the Personality Pins which are installed in the bottom of the probe plate. The probe plate “lexes” or “domes” in response to this upward force. The amount of lexing is affected by several factors.

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High Node Count Fixturing Solutions for Test Fixtures

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