ECOC 2026

Validate next-generation AI and data center interconnects with Keysight's Functional Interconnect Test Solution (FITS) and INPT-1600. This 16-channel loopback demonstration showcases scalable link validation, accelerated fault isolation, and enhanced analytics with the latest ITS software, enabling faster characterization and confidence in high-speed cable and optical interconnect performance.

This demonstration showcases the Keysight AresONE 1600GE test system together with the KAI Data Center Builder software to benchmark the performance of AI infrastructure by emulating real-world workloads. We also demonstrate the AI transport (Ultra Ethernet LLR / CBFC) validation with IxNetwork and the AI inference scale testing with KAI Inference Builder.

Validate high-speed silicon photonics and photonic integrated circuits with Keysight's automated PIC test solution. Enhanced by the new N4378A 220 GHz Lightwave Component Analyzer, the setup enables accurate electro-optic characterization, insertion loss, and polarization measurements from wafer to die, accelerating development of next-generation optical interconnects.

This demo showcases a high-speed optical research workflow for next-generation 3.2T networks and AI infrastructure. Using industry-leading AWGs, sampling oscilloscopes, and optical measurement solutions, engineers can generate, characterize, and validate ultra-high-speed PAM4 and coherent signals, reducing risk and accelerating the path from research to deployment.

This demo showcases comprehensive transmitter and receiver validation for 1.6T optical interconnects. Using Keysight’s M8050A BERT, N7718C reference Transmitter, and N1093A DCA-M, engineers can characterize signal quality, verify performance margins, and correlate results with confidence, helping reduce design risk and accelerate next-generation AI and data center linear and retimed interfaces.

See how Keysight helps manufacturers meet the demands of 1.6T optical interconnect production. High-speed optical measurements and automated interconnect validation work together to reduce test complexity, improve manufacturing efficiency, and support rapid deployment of next-generation AI networking technologies. This demo showcases Keysight's 1.6T manufacturing test workflow using the N1093B, N1096A, and Functional Interconnect Test System (FITS).

This demo shows a streamlined complete photonics workflow that bridges the gap between design, validation, and high-volume manufacturing. Simulations that combine physics and measurement data to accurately predict PIC performance. As part of Keysight's end-to-end photonics design ecosystem, RSoft seamlessly integrates with ADS Photonic Designer, enabling a smooth transition from device-level modeling to circuit and system-level validation.