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3D Interconnect Designer Software

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windows linux

Keysight recommends using the most current version, which includes the most up-to-date bug fixes and security patches available.

Release Date	Version	Version Description
2026-08-14	2026 Update 1.0	This product offers a powerful environment for designing, visualizing, and analyzing complex 3D interconnect structures across advanced packaging and heterogeneous integration technologies. Built with performance and usability in mind, 3D Interconnect Designer enables engineers to explore and validate designs before detailed implementation — helping reduce design risk and accelerate the development of next-generation electronic systems. This update release contains many new features like TSVs and staggered vias, UCIe-3D and HBM templates, Cu pillars and hybrid bonding, surface roughness, export to layout and an MCP server for AI agents.

Release Date	Version
2026-08-14	2026 Update 1.0

Version Description
This product offers a powerful environment for designing, visualizing, and analyzing complex 3D interconnect structures across advanced packaging and heterogeneous integration technologies. Built with performance and usability in mind, 3D Interconnect Designer enables engineers to explore and validate designs before detailed implementation — helping reduce design risk and accelerate the development of next-generation electronic systems. This update release contains many new features like TSVs and staggered vias, UCIe-3D and HBM templates, Cu pillars and hybrid bonding, surface roughness, export to layout and an MCP server for AI agents.

Version Description

This product offers a powerful environment for designing, visualizing, and analyzing complex 3D interconnect structures across advanced packaging and heterogeneous integration technologies. Built with performance and usability in mind, 3D Interconnect Designer enables engineers to explore and validate designs before detailed implementation — helping reduce design risk and accelerate the development of next-generation electronic systems. This update release contains many new features like TSVs and staggered vias, UCIe-3D and HBM templates, Cu pillars and hybrid bonding, surface roughness, export to layout and an MCP server for AI agents.

Note: Licenses (>=2026.02) are required for this release. If you are a supported customer, login to the Keysight Software Manager to obtain your updated licenses before installation. For other licensing tasks, see How to Obtain a License.

How to Download

How to Install

Licensing

Requires a License

Supporting Documentation

Download

SHA-256:

1511ef18d27ee80e47b4aaea9f0b187a4f834e4e681180417655086cdc81dbc7

Installs on: PC

Operating System

Win 11

Prerequisites

Release Date	Version	Version Description
2026-04-15	2026	First release of 3D Interconnect Designer: This new solution introduces a powerful environment for designing, visualizing, and analyzing complex 3D interconnect structures across advanced packaging and heterogeneous integration technologies. Built with performance and usability in mind, 3D Interconnect Designer enables engineers to explore and validate designs before detailed implementation—helping reduce design risk and accelerate the development of next-generation electronic systems.

Release Date	Version
2026-04-15	2026

Version Description
First release of 3D Interconnect Designer: This new solution introduces a powerful environment for designing, visualizing, and analyzing complex 3D interconnect structures across advanced packaging and heterogeneous integration technologies. Built with performance and usability in mind, 3D Interconnect Designer enables engineers to explore and validate designs before detailed implementation—helping reduce design risk and accelerate the development of next-generation electronic systems.