The Advanced Design System (ADS) Multilayer Interconnect Models library provides models for multiple coupled lines used in multilayer structures such as printed circuit boards (PCB), multi-chip module (MCM) devices, and integrated circuit (IC) packages.

Product Highlights

  • Multilayer structure definition for PCB, MCM, or IC package analysis
  • Simulations can run directly from schematics as opposed to EM analysis of layouts
  • Complex structure definition beyond basic microstrip or stripline configurations

The Multilayer Interconnect Models library improves analysis speed for anticipating layout effects, without requiring the Momentum Planar EM simulator. However, there is a resultant trade off in simulation speed versus accuracy. The effects of impedance, loss, crosstalk, and delay are modeled with the simplified underlying 2-D electromagnetic field solver associated with these models.

These models are also a superset of the printed circuit board models included in the Linear Simulator module. Key advantages over these models are easier parameter entry, more available model configurations, and the ability to have models on multiple layers. With the flexible multilayer substrate definition, you choose how many layers the substrate will have and the parameters that describe a vertical cross section of the multilayer structure.

The Multilayer Interconnect Models library is integrated into the W2200 ADS Core Environment. Learn more about ADS Core.