How Capacitive-Based Testing Enhances Wire Bond Detection
Case Studies
This case study examines the collaboration between an Integrated Device Manufacturer (IDM) and Keysight to test their automotive integrated circuits (ICs) using the Keysight Electrical Structural Tester (EST). The objective is to identify wire bond defects that are not visible to Automatic Test Equipment (ATE) and Automated X-ray Inspection (AXI). The proof of concept demonstrated the s8050 EST's ability to detect defects such as near shorts, wire sag, and wire sweep, which were not detectable by conventional methods.