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3D Interconnect Designer provides a flexible modeling and optimization environment for any advanced interconnect structure, including chiplets, stacked die, packages, and PCBs.
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Eliminate design cycles by creating real-world power device models resulting in simulations you can trust.
Minimum current measurement resolution
10 fA
Number of channels
7
Maximum output voltage
3000 V
Supported measurements
DC I/V, Pulsed I/V, 1 kHz to 5 MHz CV, 3 kV high voltage CV, Gate charge (Qg), On-wafer I/V, Thermal test, Power loss calculation
Maximum output current
1500 A
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The hybrid-electric and electric vehicle (HEV / EV) market is growing rapidly. Increasing vehicle electrification in the automotive market brings new challenges in design and manufacturing. Many HEV and EV manufacturers are migrating their power-conversion designs to wide bandgap (WBG) devices, such as silicon-carbide and gallium-nitride, to gain higher efficiency (extended range) and higher power in smaller, lighter, and cooler packages. However, there are significant concerns about making sure these new designs are reliable and safe.
Keysight is partnering with industry leaders in the HEV / EV power-conversion market to help them transition smoothly to using WBG devices in their designs. As a result of these relationships, Keysight has developed a state-of-the-art modeling suite of power circuit simulator tools that allow WBG device designers to easily create models never before possible. The test suite, which consists of curve-tracing, S-parameter, and double-pulse tester hardware, takes measurements from WBG devices and uses advanced software to build sophisticated simulation models that are exclusive to Keysight. These simulation models can be used in Keysight’s Advanced Design System software to simulate and analyze the effects that high-frequency components have on the reliability and electromagnetic interference of the design. Design changes can be made before the first prototype, saving time and cost by eliminating unnecessary design cycles.
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