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HMMC-5631 DC – 26.5 GHz HBT Amplifier

Data Sheets

Description

 

The HMMC-5631 is a DC – 26.5 GHz, medium power, 15 dB gain feedback amplifier designed to be used as a cascadable gain block for a variety of applications. The device consists of a modified Darlington feedback pair which reduces the sensitivity to process variations and provides 50 ohm input/output port matches. Furthermore, this amplifier is fabricated using HFTC’s HB2B InP HBT process which provides excellent process uniformity, reliability and 1/f noise performance. The device requires a single positive supply voltage and generally operates Class-A for good distortion performance. DC power dissipation is less than 0.240 Watts.

 

Absolute Maximum Ratings [1]

 

Symbol

Parameters / Conditions

Min.

Max.

Units

Vcc

Collector Pad Voltage

 

4

volts

Iout

Maximum Collector Current

 

50

mA

Pin

CW Input Power

 

10

dBm

Tj

Maximum Junction Temperature [2]

 

150

°C

TA [2]

Ambient Temperature

-55

75

°C

Tstg

Storage Temperature

-65

165

°C

Tmax [3]

Maximum Assembly Temperature

 

260

°C

 

DC specifications / physical properties [1]

 

Symbol

Parameters / conditions

Min.

Typ.

Max.

Units

Vout

Output pad voltage

2.6

2.9

3.3

Volts

Vin

Input pad voltage

1.4

1.7

2.0

Volts

Ic1

Stage one supply current

28

32

36

mA

Ic2

Stage two supply current

 

40

 

mA

 

RF specifications [1]

 

Symbol

Parameters / conditions

0 - 20 GHz

 

20 - 26.5 GHz

 

Units

 

 

Min.

Typ.

Max.

Min.

 

Typ.

Max.

 

BW

Operating Bandwidth

 

20.0

 

 

 

26.5

 

GHz

S21

Small Signal Gain

14

15.5

18

12

 

14.5

18

dB

RLin

Input Return Loss

5

15

 

4

 

6

 

GHz

RLout

Output Return Loss

5

15

 

4

 

6

 

dB

ISO

Reverse Isolation

 

-19

-15

 

 

-20

-15

dB

P-1dB

Output Power at 1dB Compression

 

15

 

 

 

13.5

 

dBm

NF

Noise Figure

 

5.5

 

 

 

6

 

dB

 

Biasing

 

The HMMC-5631 can be operated from a single positive supply. This supply must be connect-ed to two pins on the IC, namely the VCC pin and the OUT pin. The supply voltage may be directly connected to the VCC pin as long as the voltage is between +3.0 to +4.0 Volts. However, if the supply is higher than +4 Volts, a series resistor (RCC) should be used to reduce the voltage to the VCC pad. See the biasing diagram below for the equation used to set RCC. In the case of the OUT pin, the supply voltage must be connected to the output transmission line through a resistor (ROUT) and an inductor. See the biasing diagram for the equation used to set ROUT. If ROUT is greater than 300 ohms, the inductor may be omitted; however, the amplifiers gain may be reduced by ~0.5 dB.

The voltage at the In and OUT pins of the IC will be approximately 1.7 and 2.9 Volts respectfully; therefore, DC blocking caps should be used at the input and output of the device.

 

Assembly Techniques

 

The HMMC-5631 is fabricated using an InP-based HBT semiconductor material structure which limits the maximum assembly temperature to 150 C. Due to the fact AuSn solder die-attach temperatures exceed this limit, only epoxy-based die-attach materials and processes (such as 84-1LMI) should be employed during HMMC-5631 assembly.

GaAs and InP MMICs are ESD sensitive. ESD preventive measures must be employed in all aspects of storage, handling, and assembly.

Keysight application note, “GaAs MMIC ESD, Die Attach, and Bonding Guidelines" provides basic information on the subjects.

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