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Accurately detect subtle wire bond defects
Discover a nondestructive capacitive-based testing solution that accurately identifies defects in wire-bonded microelectronics.
Test types
Single Die Wire-Bonded Packages
System width
700 mm to 1,430 mm
Maximum parallel testing
4 to 20 sites
Find out what's included and explore available upgrade options from Keysight.
The Keysight electrical structural tester is a capacitive-based testing solution designed to identify wire bond defects accurately. Leveraging the advanced part average test (PAT) analysis, the tester establishes a baseline from known-good units to swiftly detect deviations like near-shorts, stray wires, wire sweeps, and sags within integrated circuits (ICs). This capability ensures robust product quality management and significantly enhances manufacturing efficiency. The electrical structural tester enables you to:
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Ensure your test system performs to specification and meets local and global standards.
Make measurements quickly with in-house, instructor-led training, and eLearning.
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