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PathWave Advanced Design System (ADS) 2021 Update 2.0 Product Release

Highlights
PathWave ADS 2021 Update 2.0 is available now!
New capabilities in PathWave ADS 2021 Update 2.0 include:
Platform
- Unarchive command is improved to skip over any libraries that have problems
- cds.lib file is supported for workspace library definition for improved interoperability with Cadence Virtuoso
Data Display
- Pictures can be inserted to a Data Display page as an image or an expression
- Datalink is upgraded to use python 3.8.5 and contains the pwdatatools package for processing measured and simulated data in any format
- DDS Palette and combo box for listing dataset are re-sizable
- Drag and drop operations can be performed from the Expression Manager
Layout
- Physical connectivity engine now supports instance arrays
- OA Path is supported to improve the ADS interoperable flow
- VIA / Teardrop transition notches in ground planes are automatically removed
- Area pins can be assigned to Padstacks and Vias without pre-existing pins needed
- Layout versus Layout (Circuit Comparison)
- New ODB++ Export for version 8 with nets, components, and stack-up to facilitate sharing minor layout edits with original enterprise PCB layout tool
- ODB++ import bug fixes including better handling of polygons with holes
RFPro EM simulation
- Can simulate impact of thickness bias of dielectrics and conductors
- A 3D metal can now fill a dielectric without needing vias
Circuit Simulation
- New Corana algorithm in Simulated Annealing optimization to find global minimum amongst extremely numerous local minima
Electrothermal
- Cross-plane > in-plane conductivity is now supported (the reverse already was)
- Allow arbitrary reduction of domain bounds
- Annotate entire device’s temperature (I.e., not just transistor fingers) in dataset
High Speed Digital - SerDes
- ADS COM calculation supports COM Version 2.93, and Batch Simulation
- Smart eye probe supports eye mask measurement
- Improved S-Parameter Checker usability including easier port set up, NEXT, and FEXT measurements
- ADS FlexDCA probe supports differential signal from single-ended eye probe for FlexDCA compliance test measurements
- Improved multi-lane Channel Sim Batch Simulation with an example
- Eye probe/Diff_Eye Probe component can now recognize PAM4_PRBS component in the name of ‘source list’ for Transient Simulation
High Speed Digital - DDR/Memory
- SIPro - New DDR analysis type (Beta Feature) – significantly speeds up simulation by 2 to 4x
- New Memory Interface AMI Model for DDR5 and LPDDR5 AMI model generation in ADS
- Memory Designer now supports new DRAM type, GDDR6 solution
- Supports integrated IBIS-ISS (Interconnect SPICE Subcircuit) model in DDR Controller/Memory components
- Improved IBIS model editor grouping, that now allows you to add and remove signals from model group in DDR Controller/Memory
- Supports multi-threading in Memory Probe for speeding up measurements
- Facilitates easy access to the S-Parameter TDR Front Panel in DDR PCB
- Improved package model setup for touchstone file with header information, by automatic IBIS pin assignment
- Improved DIMM connector setup for touchstone file with header information, by automatic signal property assignment
- Memory Designer now supports custom mask entry in Memory Probe
- Improved usability for Design Exploration, no need to use "Set" button to set the limits from the Memory probe dialog box
Power Integrity
- PIPro AC now supports parallel simulations and PathWave Design Cloud Sim Service for high performance computing
Power Electronics
- Power Electronics Model Builder tool enhancements
- Surface Current Density visualization on inner layers in PEPro