Choose a country or area to see content specific to your location
Application Notes
In digital circuits, insulating dielectrics separate the conducting parts (wire interconnects and transistors) from one another. As components have scaled and transistors have gotten closer and closermtogether, the insulating dielectrics have thinned to the point where charge build up and crosstalk adversely affect the performance of the device. It is this reduction in scale which drives the need for insulating materials with lower dielectric constant. A ‘low-k’ material is one with a small value for dielectric constant relative to silicon dioxide (SiO2)—a former dielectric of choice. The dielectric constant of SiO2 is 3.9. This number is the ratio of the permittivity of SiO2 divided by permittivity of vacuum, eSiO2/∈0,where ∈0 = 8.854 x 10-6 pFμm. There are many materials with lower dielectric constants, but few of them can be suitably integrated into a semiconductor manufacturing process[1].
Unlock Content
Sign up for free
*Indicates required field
Thank you.
Your form has been successfully submitted.
Note: Clearing your browser cache will reset your access. To regain access to the content, simply sign up again.
×
Please have a salesperson contact me.
*Indicates required field
Thank you.
A sales representative will contact you soon.