Device Modeling MBP Configuration
Configuration Guides
The Device Modeling MBP Configuration Guide provides a detailed overview of the MBP software suite, designed to support semiconductor device modeling engineers in extracting model parameters, running SPICE simulations, and generating model libraries.
At the core of the MBP software is the W6300B Device Modeling MBP core bundle, which serves as the foundational environment for all other MBP elements. The guide outlines several pre-configured bundles that combine the core environment with additional tools such as IC-CAP, MQA, or add-on features like QA express and machine learning toolkit. These bundles are designed to streamline the modeling process and enhance simulation accuracy and efficiency.
In addition to bundles, the guide details a wide range of MBP elements, each offering specialized modeling capabilities. These include extraction packages for various device types such as Bulk MOSFETs, BJTs, HV/LDMOS, Multi-gate FETs, BSIMSOI, and UTSOI. Other elements provide advanced features like graphical model viewers, silicon modeling packages, CMOS modeling tools, and enhanced HSPICE simulation links. The inclusion of QA Express and machine learning modules further supports automated model qualification and optimization.