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3D Interconnect Designer 2026 U1 Highlights
This video shows what’s new in Keysight 3D Interconnect Designer 2026 Update 1, including expanded TSV, Copper Pillar, Hybrid Bonding, HBM, and UCIe-3D support, improved physical modeling and visualization, crosstalk analysis, layout export capabilities, and new AI-assisted automation through MCP server integration.