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Pinpoint interference with post-processing spectrum management software in the lab.
Use this selector tool to quickly identify the best power supply for your aerospace and defense ATE requirements.
3D Interconnect Designer provides a flexible modeling and optimization environment for any advanced interconnect structure, including chiplets, stacked die, packages, and PCBs.
Get faster digital validation for less with a trade-in.
Emulate every part of your data center infrastructure. Emulate Anything. Optimize Everything.
With extra memory and storage, these enhanced NPBs run Keysight's AI security and performance monitoring software and AI stack.
Achieve fast, accurate board-level testing with robust inline and offline ICT designed for modern manufacturing.
Explore curated support plans, prioritized to keep you innovating at speed.
Achieve 200+ Gbaud multi-level modulated signals with high-speed AWGs for digital and optical standards.
Authoritative application notes, data sheets, reference designs, and test procedures to accelerate design and validation decisions.
Hands‑on bootcamps that teach system design, test methods, and production workflows engineers can apply immediately.
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Quick access to support related self-help tasks.
Additional content to support your product needs.
Explore services to accelerate every step of your innovation journey.
On-Demand
October 4, 2023
Date
10:00AM - 12:30 PM PT
Time
2 hours
Duration
Virtual
Location
随着算力中心阶段的到来，AI、物联网、大数据等新数字技术的加速发展显著驱动了数据云存储及智能算力需求的增长。光模块速率逐渐向800G过渡，目前已有不少龙头厂商开始1.6T/3.2T系列产品的预研工作。未来的1.6T光模块设计为提供八个信道，每个信道传输速率为200Gbps。本期研讨会主题将主要集中在单通道200G+技术、是德科技物理层及协议层方案展开讨论。
测试与测量技术人员
10:00AM PT
90
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