Solving 3D RF Module Design and Integration Challenges

Videos

This paper and demonstration will explore the assembly, integration, and Circuit-EM validation of a typical dual-band smartphone Front-End Module (FEM) in ADS using the latest innovations in the SmartMount and RFPro software elements.  

 

Learn:

 

  • How wireless transceiver designers must integrate RFIC and MMIC components, switches, matching networks and 3D components into densely packed LTCC modules.  
  • How these designs concentrate a variety of challenges into very small spaces, requiring various technologies and co-design workflows.  
  • How the FEM, Momentum, and Electro-Thermal simulators, as well as the Layout Connectivity and Layout Verification tools such as LVS, DRC, and ERC that are needed to fabricate physical designs with full confidence.