Wire Bond Integrity Tester for Post-Mold Inspection in High-Volume Semiconductor Assembly
Case Studies
This case study explores the collaboration between a leading semiconductor manufacturing service provider, specializing in testing and assembly, and Keysight to integrate the s8050 Electrical Structural Tester into the assembly line following its initial purchase. The objective is to demonstrate the integration of s8050 within the post-Mold IC assembly production for high volume manufacturing. It tackles the integration process and challenges when deploying s8050 with a handler. The s8050 takes the first step in utilizing an electrical approach to solve the need for a robust test station to screen wirebond defects.