Beam Lead Diode Bonding and Handling Procedures
Application Notes
A beam lead diode can be destroyed electrically by a static (or other) discharge through the device. It must therefore be handled so these effects cannot occur. Normal electrostatic discharge (ESD) preventive measures should be incorporated into all aspects of the storage, handling, and assembly of these devices. Specific measures to be taken should include:
- Anti–static storage trays and boxes if the diodes are kept in other than the Keysight Technologies, Inc. supplied shipping containers
- Grounded mats at work stations
- Ground straps for operators
- Static eliminators on compressed gas nozzles
- Common grounding of equipment, mats, straps, etc
- Wire bonding sequence should be designed to eliminate static discharges through chip