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Three Steps to Overcome Signal Integrity Challenges

Three Steps to Overcome Signal Integrity Challenges

White Papers

Overview

High-speed digital standards are quickly evolving to keep pace with the data demand from emerging technologies such as 5G, the Internet of Things, artificial intelligence, virtual reality, and autonomous vehicles. Each generational change of high-speed computing standards provides new signaling features, faster data transfer rates, and smaller design margins. Faster speeds create new design challenges that require higher-accuracy simulation, new software tools, and more efficient workflows.

The job of hardware engineers is to design, verify, build, and test electronic products. If they do not adopt new design methodologies, they risk product failure caused by the degradation of high-speed signals in the printed circuit board (PCB). Other risks include project delays, skyrocketing budgets, and possible career obstacles because their professional reputation is at risk. Engineers need new design tools and workflows to successfully design for the myriad interface standards, without increasing design and verification time.

Essential signal integrity analysis techniques include:

  • eye diagrams 
  • mixed-mode S-parameters 
  • time domain reflectometry 
  • single-pulse response

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