Advancing Cluster Testing for High-Density PCBA in Automotive Electronics

Application Notes

This application note delves into the dynamic evolution of Printed Circuit Boards (PCBs) and the challenges posed by the advent of multilayered PCBs, particularly in the context of limited test points. It explores the significance of testing these intricate structures and introduces the concept of cluster testing as a solution.

Multilayered PCBs, with their complex designs, present unique testing hurdles due to the scarcity of traditional test points. The document examines the conventional cluster testing methods and identifies existing challenges in their application.

In response to these challenges, a novel cluster test algorithm is introduced. This innovative approach not only automates the formation of clusters but also facilitates source verification and impedance measurement, offering a comprehensive solution to enhance testing efficiency for modern, multilayered PCBs.

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Advancing Cluster Testing for High-Density PCBA in Automotive Electronics

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