Application Notes
Advanced CMOS process technology is now driving IC designs to have smaller device scaling yet better performance. Smaller device size creates more unexpected effects and variation, which are not considered in older technologies. Consequently, simulation model libraries, required to describe all the effects and variations, are becoming huge, complicated, and difficult to read.
Not only the size and complexity of SPICE model increases, foundries also implement other types of codes to describe the special device electronic behaviors, such as encrypted SPICE model and Dynamic-link library (DLL). These types of model libraries work as a black box that users cannot view or modify the equations inside, and the model extraction tools also cannot read the contents. Consequently, this makes it even harder for modeling engineers to tune these model libraries parameters.
This application note provides information to tune complex model library using the latest PathWave Model Builder (MBP) 2020, and then verify it using PathWave Model QA (MQA).
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