Introduction to Chiplet 3D Interconnect Designer
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Chiplet 3D Interconnect Designer is a solution that streamlines the design of advanced multi-die systems by providing pre-layout workflows for defining, routing, and simulating chiplet interconnects, ensuring accuracy and reducing costly iterations.
Highlights:
The W3510E Chiplet 3D Interconnect Designer offers:
- Comprehensive interposer design – Define and simulate silicon and organic interposers for chiplet interconnects with precision.
- Standards compliance – Full support for the UCIe standard and advanced package definitions ensures interoperability and future-proof designs.
- Detailed interconnect modeling – Create microbumps, vias, and bus interconnects to accurately represent complex chip architectures.
- Flexible plane design – Supports rectangular and diamond-shaped hatch patterns for optimized signal integrity.
- Automated routing – Auto-route breakout feeds for via structures to accelerate design and reduce manual effort.
- Robust simulation capabilities – Perform both component-level and interconnect-level simulations for early validation and performance optimization.
The Chiplet 3D Interconnect Designer feature simplifies complex chiplet integration by enabling early design validation and reducing costly layout iterations. Its automated workflows and standards compliance make it ideal for accelerating the development of next-generation multi-die systems. The W3510E is an add-on product and requires a Chiplet PHY Designer license as a prerequisite.
