Building an Interoperable Chiplet Ecosystem through Golden Die Validation with Pre-Silicon Correlation
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The rapid advancement in semiconductor technology has led to the emergence of chiplet-based architectures, which promise enhanced performance, scalability, and cost-efficiency. This presentation delves into the creation of an interoperable chiplet ecosystem, emphasizing the importance of golden die validation with pre-silicon correlation. By leveraging the UCIe standard and Keysight's innovative solutions, we explore the methodologies for ensuring compliance and interoperability among chiplets from different vendors.
