3D Interconnect Designer 2026 Update 0.1 addresses bugs/tasks/stories in the following areas:

Bump definition, node-locked licenses, user-defined bump maps, simulation run, ground line routing, solder-ball simulation, vias and report generation. For more details, please refer to Release Notes. 

3D Interconnect Designer 2026 Update 0.1

Platform Filename Downloads Size md5sum
Linux 64-bit 3did_update0_1_lin_x64.tar Download

 2,61,87,77,600 bytes

f95017dde28fa87d95da3f140811f1f5
Windows 64-bit 3did_update0_1_win_x64.exe Download  2,02,98,36,176 bytes cead629c1521f9eff7749d4a00f17fc2

 

SHA 256 Values for Downloads Above

Platform SHA-256
Linux 64-bit 24057cd8544ec7ab83c8db28b4f45cf700fd2bf4cc79ef476518d257b50a4004
Windows 64-bit 2fadb027004ef2db1408cb2146ac78a7a7de109b1d24f02d59a477234d037b89

 

Note: 3D Interconnect Designer 2026 Update 0.1 is the first minor update release of the 3D Interconnect Designer 2026. You can install and run it on the same machine with 3D Interconnect Designer 2026.

Documentation

How to Install

Supporting Documentation

Prerequisites

Return to the 3D Interconnect Designer 2026 downloads page.