Flyers
The Keysight Technologies, Inc. FEM simulator element provides full wave 3D electromagnetic simulation capabilities to both EMPro and the Advanced Design System (ADS). ADS is the only design simulation platform that enables the co-design of IC, package, and board in high-frequency and high-speed applications. It seamlessly integrates system, circuit, and full 3D electromagnetic simulation with Keysight’s test instrumentation, resulting in repeatable, irst-pass electronic design success. FEM simulator is Keysight’s second-generation, interelement method (FEM), 3D electromagnetic simulator. It is integrated into the ADS design low to enable seamless co-simulation of arbitrary 3D structures such as connectors, wire bonds, and packaging with circuit and system components. This allows effects of 3D components previously dificult or tedious to include in a design simulation to be naturally accounted for without leaving the circuit design low. It is especially convenient for RF module designs where 3D interconnects and packaging must be simulated along with the circuit.
The FEM simulator element capabilities include:
3D parameterized components of commonly used structures such as wire bonds, solder balls, solder bumps, connectors and packages to speed up 3D design input and enables geometry sweeps and co-optimization with circuit components
Unlike other equally capable stand-alone simulators, the FEM simulator is integrated into the ADS design low and can save up to 2 hours of manual data integration per simulation run. In addition, integration allows you to perform 3DEM-circuit-system co-simulation and co-optimization for realizing your best possible design in one pass.
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