Demos
This video showcases how Smart-Mount technology, integrated with RFPro EM simulation in (ADS), enables efficient first-pass design of Heterogeneous Integrated modules. This synergy allows ADS to meet the 3DHI stringent requirements on SWaP-C (Size, Weight, Power, and Cost), making it the ideal platform for developing next-generation 3DHI modules with enhanced design accuracy and speed.
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