Amkor Technology is a leading provider of semiconductor assembly and test services to semiconductor companies and electronic OEMs. More information on Amkor is available from the company's website at http://www.amkor.com/go/about-us.

Please visit the Amkor Technology website directly for downloading the latest ADS Package Design Kits.

Package Design Kits Available From Amkor Technology

  • The initial design kit v1.0 contains 3x3, 4x4, 5x5, and 6x6 MicroLeadFrame packages with 0.5 lead pitch. All dies are scalable. The kit works with ADS 2009, ADS2009 Update 1, ADS 2011.01, ADS 2011.05, ADS 2011.10 and ADS 2012.08.
  • The updated design kit v1.1 contains 3x3, 4x4, 5x5, 6x6, 7x7, and 8x8 MicroLeadFrame packages with 0.4 lead pitch and 0.5 lead pitch. All dies are scalable and can be offset from the center. Based on many customer requests, the 8x8 DRMLF (Dual-Row MLF) is included in this updated design kit. The kit works with ADS 2009, ADS2009 Update 1, ADS 2011.01, ADS 2011.05, ADS 2011.10 and ADS 2012.08.
  • The newest design kit v2.0 contains 3x3, 4x4, 5x5, 6x6, 7x7, and 8x8 MicroLeadFrame packages with 0.4 lead pitch and 0.5 lead pitch, as well as an 8x8 DRMLF (Dual-Row MLF) package with 0.5 lead pitch. The kit is compatible with the ADS 2012.08 multi-technology flow, and contains sample workspaces and instructions to allow multiple circuits on arbitrary substrates to reside in your package. The kit works with ADS 2012.08.
  • The download is a ZIP file which contains three different versions of the design kit.
  • For downloads, please refer to: http://www.amkor.com/go/ads

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For more information on Amkor Technology, refer to their website at Amkor Technology.

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