What to Expect at Keysight EDA Connect World Tour
In today's hyperconnected world, staying at the forefront of electronic design trends is more crucial than ever. As we gear up for a new year, we decided to find a new way to bring the power of the modern design center to design engineers and leaders worldwide.
Beginning in January 2024, the Keysight EDA Connect World Tour is set to embark on a journey that spans more than 20 destinations across four regions – North America, Europe, Asia Pacific, and Great China.
Figure 1. A map of the Keysight EDA Connect World Tour stops
The Tour features content, demos, and speakers tailored to each region, under the theme “Shift Left with the Modern Design Center.” Over 20 papers will address how to accelerate time-to-market and realize bold design innovation – across the RF circuit, RF system, high-speed digital, and device modeling domains - using artificial intelligence (AI) advancements, automation, and design-to-test workflow modernization. Whether you are a longtime Advanced Design System (ADS) customer or an RF design novice, we designed this event to cater to your unique needs.
Here are three highlights you can expect when attending the Tour in a city near you:
#1: Speakers, content, and insights tailored to your region
The Modern Design Center is for everyone, but we understand that every design team has its own unique characteristics, so we are ready to deliver content, sessions, and breakouts that address those diverse needs. Expect to hear from your local design leaders and Keysight product experts who will share their unique insights into the future of "shift-left." Dive into multiple technical sessions in four modules, offering comprehensive training across various disciplines and how they seamlessly integrate into a connected workflow from design to test.
Module 1 – Accelerate smart RF IC design
A successful RF design moves beyond mere specification compliances. Discover how Keysight Electronic Design Automation (EDA) 2024 simplifies RF design, including AI-driven power amplifier design and the rapid co-design of electromagnetic circuits. We believe insights from the presentations in this module will expedite the development of modern RF circuits for a hyper-connected future.
Here's a preview of some of the presentations within this module:
Load Pull Design Techniques for Power Amplifiers Leveraging Measurements and AI/ML
We'll guide you through the process of importing, cleaning, and visualizing measured load-pull data. Discover how to use this data to craft efficient impedance-matching networks and artificial neural network (ANN) models for nonlinear simulations. With practical examples, you will learn how load-pull data can supercharge Power-added Efficiency (PAE), Error Vector Magnitude (EVM), and Adjacent Channel Leakage Ratio (ACLR) in your power amplifier designs.
Rapid EM-Circuit Co-Design of Microwave ICs, Packages, Modules and PCBs
RF designers use PC Boards and Modules to physically integrate transceivers and functional systems at a lower cost than custom IC design. However, smaller modules, deeper process and technology stacks, and complex hierarchies, layer stack-ups, and tool vendor formats can make assembly, circuit-EM co-design, and co-verification tricky. Discover a new approach for quick module integration in just seconds or minutes. (Hands-on demos available at some locations.)
Solving 3D Module Integration Challenges for High-Performance Microwave Design
Wireless transceiver designers face the challenge of fitting various components - RFIC and MMIC components, switches, matching networks and 3D components - into small LTCC modules. This presentation explores how to perform efficient and reliable assembly, integration, and Circuit-EM validation for a dual-band smartphone Front-End Module (FEM) using the newest features of Keysight EDA’s SmartMount and RFPro.
Module 2 – Achieve high-speed in the chiplet era
Chiplets are here to stay. However, addressing the complexities of thermal, power, and signal integrity at both the chiplet and package levels and multiple die-to-die interfaces necessitates innovative strategies. Explore cutting-edge architectural strategy and best practices to enhance high-speed digital design workflows, ensuring success in the chiplet race. Let's preview some of the presentations in this module.
Analyzing Die-To-Die Interfaces In Multi-Die High-Speed Digital Designs
In this presentation, we'll cover the basics of chiplet high-speed standards, such as UCIe communication from one Die-to-Die (D2D) PHY to another D2D PHY. You'll also learn how to simplify the simulation of eye diagrams, Bit Error Rate (BER), contours, and Voltage Transfer Function (VTF) using an intelligent design environment.
Join us to kickstart your chiplet innovation
Simulation-Driven Compliance Solutions For PCIe6 And USB4v2 Standards
Ready to embrace the future of data transfer with PCIe6 and USB4v2? These standards offer faster data rates for AI/ML and cloud computing application by using PAM4 and PAM3 signaling. Yet they come with new design challenges, from stricter tolerances and new components that designers don't have control over. Learn how to overcome these challenges and ensure compliance through simulation-driven solutions and Method of Implementation (MOI) workflows.
Module 3 – Power RF system design innovation
Learn how Keysight EDA's latest offerings, including integrated system / circuit design workflows and AI integration for 5G air interfaces, are revolutionizing RF system design. Global design organizations share their shift-left challenges and success stories. Let's see what you can learn from this module.
RF System Design techniques leveraging Spectrasys, Phased Array Analysis, and Data Flow Simulation
Learn how Spectrasys, Phased Array Analysis and Data Flow simulators can increase the fidelity of RF system designs. Validate your system design with realistic modulated signals and extract authentic time-domain metrics. Surpass spreadsheet limitations, unlocking unmatched diagnostic capabilities in RF system architecture tools. Transform your phased array design expertise with industry-leading speed, simplified capture, and cutting-edge analysis.
Register now to unlock the strategies to save millions of dollars from accurate predictions and unprecedented exploration.
New System Verification Tools in ADS for Circuit Designers
Challenge your understanding of how circuit and system designers collaborate with PathWave Explorers in Keysight ADS. Experience the unification of circuit and system design into a contiguous workflow, whether working in ADS or sharing a design between ADS and System Design using the new Extracted Behavioral Models (EBM).
Module 4 – Elevate device modeling accuracy and efficiency
For more than two decades, Keysight has been at the forefront, providing top-tier foundries and integrated device manufacturers with comprehensive solutions encompassing semiconductor device measurement, extraction, and validation worldwide. In this module, you will hear innovative strategies ― from model recentering to gallium nitride (GaN) modeling ― designed to enhance model quality across a spectrum of devices. Our primary goal is to empower you to achieve robust modeling results while minimizing tedious, error-prone processes.
Accurate Modeling of the Self-Heating and Trapping Effects in GaN HEMTs
Self-heating and trapping Effects in GaN HEMTs significantly impact the device performance. Accurate modeling of these effects can effectively save on subsequent circuit design costs. This session provides strategies and methods for modeling these effects effectively.
#2: Shift-left challenges and success stories from global design organizations
We will feature success stories from regional customers including but not limited to L3Harris, Analog Devices, Raytheon, Lockheed Martin, and BAE Systems, that shed light on their shift-left journey.
From initial motivations to valuable lessons learned, these stories will highlight specific use cases, actionable strategies, and the future visions of electronic design. Learn from global design organizations as they share their insights and experiences.
#3: Free training for all attendees — with prizes
We will offer all registered participants an opportunity to participate in free design courses curated by our tech experts. Explore more advanced concepts for shifting left at scale and how to build a successful modern design center.
Plus, we have special surprises for you. We believe in keeping things exciting and rewarding for our attendees. While we will not reveal all the details just yet, rest assured that there's a delightful surprise for you during each seminar. We are committed to making your educational experience informative, engaging, and fun.
Conclusion
We have provided just a glimpse of what attendees can expect at the Keysight EDA Connect World Tour. Don't miss this opportunity to connect with fellow professionals, engage with experts, and gain insights to help your team design better, bolder, and faster.
Save your seat today, and let's supercharge your shift left together!