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Minor Revisions, Meaningful Impact: Keysight Device Security Solutions

As hardware security testing evolves, consistency and signal quality across Side‑Channel Analysis (SCA) and Fault Injection (FI) workflows remain critical. To support this, the Keysight Device Security team has introduced a set of minor product revisions focused on internal alignment and long‑term stability, without changing existing testing methodologies. The DS1140B 1.5 A Glitch Amplifier, DS1203B High Precision Electromagnetic Probe, and DS1121B Bidirectional Fault Injection Probe have each been updated to improve internal electrical compatibility while preserving interfaces, workflows, and day‑to‑day usage.

More specifically:

DS1140B 1.5 A Glitch Amplifier delivers sharp, repeatable voltage glitches for precise voltage‑based fault injection.
DS1203B High Precision Electromagnetic Probe is used to capture localized electromagnetic emissions from semiconductor devices during side‑channel analysis.
DS1121B Bidirectional Fault Injection Probe is designed for high‑power electromagnetic fault injection at precise chip locations, delivering fast and predictable EM pulses.

In practice, these products continue to support the two core hardware security testing approaches, illustrated here through common Side‑Channel Analysis (SCA) and Fault Injection (FI) setups.

For Side‑Channel Analysis, a target device, such as an SoC or secure element, executes a controlled operation while power consumption or electromagnetic emissions are measured. Power‑based measurements are typically performed using an Active Current Probe, a high‑frequency probe that actively captures electrical currents to observe a target device’s power consumption during operation. Electromagnetic leakage can be measured using the DS1203B High Precision Electromagnetic Probe. The acquired traces are processed and analyzed using Inspector Software Side Channel Analysis, which provides workflows for acquisition, alignment, and leakage analysis.

For Fault Injection, controlled disturbances are applied to the target device to evaluate its behavior under abnormal conditions. Voltage‑based fault injection is performed using the DS1140B 1.5 A Glitch Amplifier, while electromagnetic fault injection is carried out using the DS1121B Bidirectional Fault Injection Probe. Triggering and timing are coordinated using a pattern‑based trigger such as the DS1180A Glitch Pattern Generator, enabling precise alignment of fault injection with target execution. Inspector Software Fault Injection coordinates triggering, executes fault‑injection campaigns, and analyzes device responses, allowing engineers to assess resilience against physical attack techniques in a controlled and repeatable manner.

These revisions ensure that both SCA and FI approaches remain consistent, reliable, and aligned as testing requirements continue to evolve.

As embedded systems grow in complexity and physical attack techniques continue to mature, maintaining stable and consistent hardware security test infrastructure becomes increasingly important. The Keysight Device Security team remains committed to supporting security researchers and engineers with dependable tools that help keep devices and systems secure.

Ready to build or expand your device security test lab? Contact us to learn more.

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