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SI/PI PCB Design Considerations for Thermal Webcast
Typically signal integrity (SI) and power integrity (PI) engineers set or assume the temperature for analysis at room temperature. However, the temperature may be higher than that, depending on the DUT location on PCB. What thermal effects for SI and PI do we anticipate if the PCB temperature is high? In this webcast, we will review the thermal effects on your PCB designs and demonstrate the performance changes due to the temperature change based on a practical case study.
PRESENTER
Hee-Soo Lee, 3D EM Applications Specialist, Keysight EEsof EDA
Hee-Soo Lee holds a BSEE degree from the Hankuk Aviation University, Korea. He has more than 20 years of design and simulation experience in the area of RF and Microwave designs, and is currently the Applications Specialist for 3D EM solutions at Keysight EEsof EDA.
Where and When
Event Details
Price: Free
Location: At Your PC
For more information: Enroll to view the January 25, 2018 recorded broadcast
Prices shown are list prices and are subject to change without notice.
