您可能感興趣的網頁。 觀看搜尋結果:

 

聯絡是德專家

Solder Paste Inspection and Management: SP50 Series 3 XL

產品狀態: 已停產 | 查看服務選項
此產品已停產

此產品沒有替代產品。

主要技術規格

  • Full 3D inspection with speed up to 38.7cm^2/sec (6in^2/sec) *speeds may vary depending upon application
  • Head Swap to SJ50 Series 3 XL available
  • 23.5x23.5” (610x610mm) board size capability
  • CMOS camera
  • 16 μm per pixel resolution (scalable)
  • 4 μm height resolution
  • Shadow free dual laser triangulation inspection method

敘述

The SP50 provides users with blazing throughput, excellent repeatability, and full volume, height, area, and registration measurements. The SP50 can handle boards up to 23.5x23.5” and has the advantage of the Keysight head swap technology. The head swap allows users to alternate their equipment from an SP50 to an SJ50 with a simple procedure that takes less than one hour. The SP50 uses optical encoders and linear motors to allow smooth transitions.

To learn more, request additional product information.

Login at the top-right of this page to view restricted information for customer with login account.

Find the latest software patches in Technical Support –> Drivers & Software.