產品特性

  • 短線測試夾具技術確保可攜性、可重複性和穩定性
  • 創新設計確保易維護性和測試夾具變化
  • 輕巧機箱,比傳統的 3070 系統節省 33% 的占地面積
  • 自動化 ICT 解決方案實現單點連接
  • 全套系統套件包含各種邊界掃描工具

Keysight i3070 系列 5i 保留了 Keysight 3070 和 i3070 系統廣受歡迎、獨家的短線測試夾具技術。

短線測試夾具技術克服了長線夾具的常見問題,例如雜訊和測試穩定性降低。 也就是說,即便是您需要橫跨半個地球或在不同的製造基地部署測試,i3070 系列 5i 均可提供可轉移、可重複和穩定的測試。

i3070 系列 5i 為忙碌的生產線操作人員和測試工程師提供簡易測試操作。 外掛程式箱安裝在重型滑軌上,可輕鬆拉出以更換模組卡。

一款符合人體工程學設計的組合抽屜方便您輕鬆裝入或卸下測試系統中的測試夾具。 這些特性可節省時間和體力,尤其是在生產線正在測試多元化產品時。

智慧夾具識別、電路板定向探測和測試計畫版本控制等工具,可協助您開發業界一流的自動化解決方案。

i3070 系列 5i 與您的 3070 和 i3070 測試程式完全相容。

主要技術規格

Fixture Actuation
Press Down
最大節點計數
2592
Max Parallel Testing
2
System Type
Automated Handler
System Width
1206 mm
Fixture Actuation
最大節點計數
Max Parallel Testing
System Type
System Width
Press Down
2592
2
Automated Handler
1206 mm
查看更多
Fixture Actuation:
Press Down
最大節點計數:
2592
Max Parallel Testing:
2
System Type:
Automated Handler
System Width:
1206 mm
E9988E In-Line 2-Module ICT System

Interested in a E9988E?

Featured Resources for E9988E 2-Module In-Circuit Test (ICT) System, i337x Series 5i

Application Notes 2024.01.30

Streamlining In-System Programming

Streamlining In-System Programming

This application note explores the challenges and solutions in implementing In-System Programming (ISP) on densely populated circuit boards. Focusing on Keysight's advanced ICT system, the document discusses upgraded hardware configurations and introduces the ISP OpenTAP plug-in for streamlined test sequence generation. With a simplified approach to test generation and execution, Keysight's solution offers an efficient pathway for ISP integration. This resource serves as a practical guide for test engineers seeking to optimize ISP processes, enhance efficiency, and reduce complexities in programming.

2024.01.30

Application Notes 2024.01.30

Integrating x1149 Boundary Scan Analyzer for Enhanced Modularity and Versatility

Integrating x1149 Boundary Scan Analyzer for Enhanced Modularity and Versatility

This application note explores the integration of Keysight's x1149 Boundary Scan Analyzer with the i3070 Series 7i In-Circuit Test System, introducing a flexible and efficient approach to boundary scan testing. The integration eliminates challenges associated with built-in boundary scan systems, offering enhanced security, modularity, and greater flexibility in adapting to evolving protocols and functionalities.

2024.01.30

Application Notes 2024.01.29

New i3070 Series 6 is 1.5x Faster than the Series 5

New i3070 Series 6 is 1.5x Faster than the Series 5

This application note summarizes some of the results of Vectorless Test Enhanced Probe (VTEP) early tests conducted at customer sites.

2024.01.29

Application Notes 2024.01.25

Quad Density Pin Card for Enhanced Throughput and Reliability

Quad Density Pin Card for Enhanced Throughput and Reliability

This application note addresses the evolving challenges in testing modern and densely packed Printed Circuit Board Assemblies (PCBAs) and introduces the Quad Density (QD) pin card as a groundbreaking solution. As electronic systems grow in complexity, the need for comprehensive testing becomes crucial. The current limitations of double-density pin cards prompt the development of the QD pin card, which offers 320 test pins on a single board, more than doubling its predecessor's capabilities. The QD pin card not only enhances test pin capacity but also introduces features like built-in discharge circuits and temperature sensors to optimize testing efficiency. Backward compatibility ensures seamless integration with older testing systems, and electronic serial number storage facilitates easy identification and troubleshooting.

2024.01.25

Application Notes 2024.01.24

Advancing Cluster Testing for High-Density PCBA in Automotive Electronics

Advancing Cluster Testing for High-Density PCBA in Automotive Electronics

This application note delves into the dynamic evolution of Printed Circuit Boards (PCBs) and the challenges posed by the advent of multilayered PCBs, particularly in the context of limited test points. It explores the significance of testing these intricate structures and introduces the concept of cluster testing as a solution.

2024.01.24

Application Notes 2024.01.23

Enhanced Short Tests for High Impedance Nodes

Enhanced Short Tests for High Impedance Nodes

This application note introduces an Enhanced Short Test algorithm tailored to tackle the testing challenges associated with high-impedance nodes in Printed Circuit Board Assemblies (PCBAs). Integrated into the Keysight In-Line High-Density In-Circuit Test (ICT) system, the Enhanced Short Test significantly boosts the efficiency of short detection for high-impedance nodes, leading to a noteworthy 57% reduction in testing time. High-impedance nodes, commonly found in modern PCBAs to enhance signal quality and reduce power consumption, present difficulties such as extended stabilization times, heightened sensitivity, diminished current flow, intricate isolation procedures, and concerns regarding signal stability.

2024.01.23

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