The Future of Electronic Manufacturing Test: Trends and Innovations

In an era where AI is transforming industries and reshaping possibilities, electronic manufacturing tests stand at the forefront of this revolution. This year, we focus on the trends and innovations driving smarter, faster, and more efficient testing solutions. From leveraging AI-powered analytics to advancing high-speed testing and integrating sustainable practices, the future of testing is being redefined to meet the demands of a rapidly evolving technological landscape.

Join us as we explore how these groundbreaking advancements are setting new benchmarks for quality, reliability, and performance. Embrace the theme of ‘The Future of Electronic Manufacturing Test: Trends and Innovations,’ and be inspired to lead in this exciting, AI-driven era.

Manufacturing Test User Group Meeting

Discover Manufacturing Testing Excellence: Join us at the annual Keysight Customer User Group Meeting, where industry leaders and experts convene to share knowledge and insights on the latest manufacturing testing challenges and solutions. Engage with notable speakers, explore knowledge sessions covering data-driven manufacturing and advanced technologies, and witness ICT NPI showcase. Our engaging demo booths, interactive games, and interview sessions promise an immersive experience. Plus, seize the chance to win exciting quiz draw prizes. Notable industry players, from Jabil and Intel to newcomers like Cisco and Broadcom, underscore the event's industry influence. Don't miss the opportunity to elevate your expertise and network with the best in the field.

Your Passport to Knowledge

At our UGM, join tech visionaries and analysts as they engage you in an opening keynote on near-term trends, an industry panel discussing key challenges ahead, and a future-looking closing keynote.

Notable Speakers

Keynote Presentation

Our event features distinguished speakers who will share their knowledge on a range of industry challenges and innovative solutions, providing valuable insights that can shape your approach to manufacturing testing.

Knowledge Session

Knowledge Session

Dive into a series of informative sessions covering essential topics. Explore and stay up-to-date with the latest advancements.

Notable Speakers

Exclusive NPI Showcase

Get an exclusive look at our latest offerings in the world of In-Circuit Test New Product Introduction (ICT NPI). Witness how our technology can revolutionize your testing processes

Notable Speakers

Demo Booth

Interact with our engaging demo stations to explore in-circuit and board test systems, Big Data Analytics, boundary scan solutions, Keysight services, and partner demos. Participate in our booth game for added fun and the chance to win exciting prizes.

Notable Speakers

Engagement Opportunities

Engage with us for knowledge exchange, quizzes, interviews, and the chance to win quiz draw prizes. We're dedicated to fostering a dynamic learning environment for all participants.

Meet Keysight's Tech Leaders

Hear from Keysight's leaders and technology experts on manufacturing tests.

Carol Leh

Carol Leh

Vice President / General Manager
Electronic Industrial Solutions Group

Yapp Poey Hee

Yapp Poey Hee

Director of Product Management
Electronic Industrial Solutions Group

Sam Wong

Sam Wong

Business Development Manager
Electronic Industrial Solutions Group

Andrew Tek

Andrew Tek

Product Planning Manager
Electronic Industrial Solutions Group

Peter Mosshammer

Peter Mosshammer

Business Development Manager
Automotive and Energy Solutions
Electronic Industrial Solutions Group

Adrian Gaudencio Ababa

Adrian Gaudencio Ababa

Business Development Manager
Automotive and Energy Solutions
Electronic Industrial Solutions Group

Daniela Garcia

Daniela Garcia

Business Development Manager
Electronic Industrial Solutions Group

Luis Sosa

Luis Sosa

Global Account Manager

Rodrigo Cantú

Rodrigo Cantú

Solutions Engineer at Silicon Valley

Explore Tomorrow's Tech Landscape

Key Topics at UGM Event

Industry Keynote of Emerging Trends

Industry Keynote of Emerging Trends

Industry Keynote of Emerging Trends and Technologies in Radar, LIDAR and Scaling Manufacturing Tests

Keysight Manufacturing Test Technology Portfolio

Keysight Manufacturing Test Technology Portfolio

Exploring the Keysight Manufacturing Test Technology Portfolio: A comprehensive journey from offline ICT to inline ICT, along with diverse software solutions designed to elevate your manufacturing test experience.

Exclusive New Product Introduction Showcase

Exclusive New Product Introduction (NPI) Showcase

Exclusive New Product Introduction (NPI) Preview: Unveiling the s8050 Electrical Structural Tester tailored to identify microelectronics wire bond defects. Discover Strategies to Enhance Test Throughput with the i7090 Massively Parallel Board Test System. Explore New x1149 Boundary Scan Analyzer Standards for Maximizing Test Coverage.

Never-Before-Seen Solutions

Never-Before-Seen Solutions

Go behind the scenes! Get an insider scoop on never-before-seen product releases and a first-hand demonstration of our prototype solutions.

Find an Event Near You

Johor Bahru, Malaysia

UGM India

When: Q2'25
Time: TBA
Where: TBA

 

Johor Bahru, Malaysia

UGM Malaysia

When: Q3'25
Time: TBA
Where: Penang

 

UGM ShenZhen

UGM China

When: Q3'25​
Time: TBA
Where: ShenZhen

 

Guadalajara, Mexico

UGM Mexico

When: Q4'25
Time: TBA
Where: Guadalajara

 

UGM SuZhou

UGM China

When: Q3'25​
Time: TBA
Where: SuZhou

 

UGM Germany

UGM Germany

When: Q4'25
Time: TBA
Where: TBA

 

Featured Resources

White Papers 2025.01.14

Testing Analog and Digital Components in Modern PCBAs

Testing Analog and Digital Components in Modern PCBAs

This whitepaper examines the testing practices essential for validating analog and digital components in modern printed circuit board assemblies (PCBAs). It outlines key techniques such as in-circuit testing (ICT), boundary scan, mixed-signal analysis, and approaches for diagnosing and ensuring component reliability. The paper also highlights the capabilities of the Keysight i7090 test system, designed to address the challenges of high-mix, high-volume PCBA production with precision and efficiency.

2025.01.14

White Papers 2025.01.13

Enhanced Polarity Check for Improved Accuracy and Reliability

Enhanced Polarity Check for Improved Accuracy and Reliability

This whitepaper explores the enhanced Polarity Check technology for SMD J-lead Tantalum capacitors, providing a more accurate and efficient method for orientation detection.

2025.01.13

White Papers 2024.08.15

Wire Bond Electrical Structural Test Methodologies

Wire Bond Electrical Structural Test Methodologies

Wire bonding, a foundational process in microelectronics, is essential for establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, in the case of multi-chip modules, between different chips. A connection is made from the bond pad on the chip to a corresponding pad on the package substrate or another chip through the meticulous bonding of a fine wire—usually composed of materials like gold, aluminum, or copper. This intricate process ensures the device's functionality, reliability, and overall performance. Several wire bonding testing methods have been developed and adopted to capture defects in molded integrated circuits (ICs) in microelectronics. However, the current testing methods on the market have their own strengths and weaknesses; they are not comprehensive but rather complement each other. An innovative method called capacitive testing has been developed to provide more comprehensive wire bond testing, detecting wire bond defects that are invisible with conventional testing methods. These defects include near shorts, wire sweep, wire sagging, and more.

2024.08.15

White Papers 2024.07.01

A Unified Approach to In-Circuit Testing (ICT) and Functional Test (FCT) Integration

A Unified Approach to In-Circuit Testing (ICT) and Functional Test (FCT) Integration

When it comes to manufacturing electronics, two types of tests are commonly used to ensure the quality and reliability of the products: In-Circuit Tests (ICT) and Functional Tests (FCT). Although distinct from each other, these testing methods are complementary and serve specific purposes in the production process. ICT is a process used to test the integrity of individual components and connections on a Printed Circuit Board (PCB). A Functional Test (FCT) is a test that assesses the overall functionality of a finished electronic product through a range of test scenarios designed to mimic real-world usage conditions. Manufacturers often separate these two testing methods into different stages due to differences in their testing methodologies, objectives, and the types of defects they are designed to detect. However, by unifying these testing methodologies and leveraging their strengths, manufacturers can achieve thorough quality control, reduce defects, and lower costs. This approach is particularly beneficial in all aspects of manufacturing, especially in the automotive sector, where intricate electronic components and interconnected subsystems are prevalent.

2024.07.01

White Papers 2024.01.17

The Future of In-Circuit Testing in the High-Speed, Complex Electronics Environment

The Future of In-Circuit Testing in the High-Speed, Complex Electronics Environment

In high-speed, complex, electronics environments, the future of ICT solutions must overcome a multitude of issues.

2024.01.17

White Papers 2022.08.16

Design for Manufacturing and Test

Design for Manufacturing and Test

A common ‘Design for Excellence’ approach in any product design process is the ‘Design for Manufacturing’ which is simply to ensure the products are easier to be manufactured. A significant and important part of this approach is the ‘Design for Manufacturing Test’ concept. A final product that was manufactured but is difficult to test to effectively measure its quality and reliability before shipping out may result in disastrous consequences when these products fail out in the field, especially when the products are used in mission-critical industries such as the automotive industry. In this white paper, we will look into detail of a single but important task that a design engineer needs to do as part of their design workflow. This task is where the engineer will need to decide which components to use and from which vendor in order to achieve the best outcome in terms of manufacturability. Here, we will introduce a concept and use case of ‘Design for Manufacturing Test’ to allow design engineers to focus more on their development.

2022.08.16

白皮書 2019.08.22

《工業物聯網對企業營運的影響及其量測機制》

《工業物聯網對企業營運的影響及其量測機制》

近年來物聯網(IoT)的蓬勃發展,使我們的生活和我們與周遭環境互動的方式,產生巨大的轉變。 它將全世界串連在一起,使得我們周遭的實體物件,能轉變為一個資訊生態系統。 製造工廠藉由強化物聯網(即透過工業物聯網),於下列三個主要營運主軸中實現更高的績效以及附加價值:智慧資產和設備管理、增強的生產流程和運作,以及資源最佳化運用。

2019.08.22

白皮書 2019.06.24

以資料分析實現準確快速的設計決策

以資料分析實現準確快速的設計決策

使用整合式資料分析軟體,做出更明智的設計決策。 此軟體能夠縮短工程師的設計週期,減少重新設計次數,並可藉由經整合的設計與測試工作流程,提升生產率並降低風險。

2019.06.24

白皮書 2019.01.04

更智慧化的工廠-工業4.0的驅動力

更智慧化的工廠-工業4.0的驅動力

了解如何利用工業 4.0 讓您的工廠更智慧化。是德科技的 PathWave Manufacturing Analytics 可以提高您的生產力並節省資金。

2019.01.04

白皮書 2018.09.20

Accelerating from 100GE to 400GE in the Data Center Advanced Modulation and Coding Challenges

Accelerating from 100GE to 400GE in the Data Center Advanced Modulation and Coding Challenges

The move from 100GE to 400GE in the data center is revolutionary, not evolutionary. Optical transceivers will need to use advanced signal modulation and coding to reach 400GE speeds. These techniques create new test challenges for transceiver manufacturers.

2018.09.20

白皮書 2018.06.10

Accelerate Innovation by Improving Product Development Processes

Accelerate Innovation by Improving Product Development Processes

Getting from concept to shipment as fast as possible is the goal of virtually every product development team. Business imperatives constantly pressure development teams to improve their simulation tools, cut design cycle times, and reduce test time to bring products to market faster. This white paper explores techniques and methodologies for improving product development processes in order to accelerate innovation.

2018.06.10

白皮書 2017.01.24

IBIS-AMI Modeling of Asynchronous High Speed Link Systems  from DesignCon 2017

IBIS-AMI Modeling of Asynchronous High Speed Link Systems from DesignCon 2017

This paper proposes a modified IBIS-AMI model simulation flow for asynchronous link systems.

2017.01.24

Highlights From our Past UGM Event

UGM 2023 Penang Interview


4 minutes

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