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Ключевые возможности и технические характеристики

Signal analysis

  • LTE-Advanced TDD per 3GPP Release 10/11/12 standard
  • Carrier aggregation (CA) of up to 5 contiguous or non-contiguous component carriers (CCs) for uplink and downlink
  • Clustered SC-FDMA and simultaneous PUCCH and PUSCH uplink analysis
  • Runs inside PXA, MXA, and EXA signal analyzers and VXT PXIe vector transceivers with Windows 7 operating system (standard)

Measurements

  • Output power level: channel power, transmit on/off power
  • Transmitted signal quality: EVM, frequency error, time alignment error, I/Q offset, and more; pinpoint signal impairments with color-coded traces per component carrier such as EVM vs. symbol, EVM vs. subcarrier, detected allocations (subcarrier vs. symbol), constellation diagram, and frame summary
  • Unwanted emissions: SEM, cumulative SEM, ACLR, cumulative ACLR (CACLR), OBW, spurious emissions, transmitter intermodulation
  • All measurements are available for uplink and downlink containing up to 5 CCs with contiguous or non-contiguous allocations

Other features

  • Windows 7 operating system and N9082A or N9082B Option 1FP are required in order to use this option
  • License-key upgradeable
  • Fixed and transportable license available
  • SCPI remote user interface

Описание

Option 2FP enables you to perform LTE-Advanced TDD RF transmitter measurements of up to five component carrier on eNB and UE devices in time, frequency, and modulation domains as defined by 3GPP TS 36.141 and 36.521 transmitter characteristics. For demodulation measurements, such as EVM and frequency error, the measurement application offers two modes for acquisition of up to 5 carriers. The first mode offers simultaneous acquisition of up to 5 intra band contiguous/ non-contiguous component carriers with a single wideband capture (requires PXA/MXA with 160 MHz bandwidth), or the second mode which uses an automatic sequencing function, eliminating the need for the wide analysis bandwidth option on the X-Series signal analyzer, thereby reducing the overall test equipment cost.

This option can be added as a product upgrade.

 

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