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PS-X10-100 High Speed Physical Layer Characterization and Modeling Service

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Principais recursos e especificações

  • Impedance measurements on high-speed interconnects, including backplanes, connectors, and cable assemblies
  • Also, we measure and characterize ATE test sockets and DUT boards; BGA and chip-scale packages; and flexible circuit boards
  • SPICE model generation and validation from actual impedance measurements is available
  • Frequency-dependent loss modeling, insertion and return loss analysis is available
  • Examples of buses that benefit from these measurements include PCI Express, USB2.0, InfiniBand, SATA, SCSI, High-speed Gigabit Ethernet, Sonet/SDH, and memory interfaces


A Keysight engineer will setup measurements using the appropriate test equipment, probe fixtures, probes and probing techniques. After the measurements are made, the Keysight engineer will use software to enhance the measurements, and generate SPICE models of the measured components. The models are validated by directly comparing the simulation of the model with the actual measurement made. Models can be provided in HSPICE, PSPICE, Berkley SPICE, or IBIS-compatible formats.

Frequency-dependent skin-effect and dielectric-loss transmission-line models can also be created. You can use these models to predict eye-diagram degradation and SI-related digital errors in high-speed interconnects.

A minimum of two days is required for a qualified Keysight Engineer to complete measurement setups, make the measurements, and compile the SI data. The actual time will be dependent on the scope of the measurements you request. This service is provided either at your site or in a Keysight lab.

This service is currently only available in the United States. Contact your local sales representative for more information.