Preço para o: Brasil
* Os preços não incluem impostos ou taxas, os quais deverão ser considerados na oportunidade em que emitida a cotação formal, conforme determinação das autoridades governamentais competentes. Os preços mostrados são os preços de varejo sugeridos pelo fabricante (MSRP). Os preços apresentados não incluem impostos.
Descrição
The ADS Core, TransConv, Channel, IT, Bundle is recommended for the signal integrity analysis of high-speed digital links, prior to layout. It enables the user to explore early link designs, sweeping parameters to evaluate and optimize transmitter and receiver settings, substrate stack-up design and routing choices for transmission lines, together with modeling of the interconnects. In this manner the user can determine the performance margin of the link. This feature set is also powerful for system verification, where S-parameter data for the channel (derived from measurement or electromagnetic simulation) is imported and available to use.
This bundle does not contain Electromagnetic (EM) simulation technology for SI and PI design tasks. Please refer to W2223BP/BT for applications where EM simulation is required.
The ADS Core, TransConv, Channel, IT, Bundle functionality is shown in the table below.
| Model Number | Name | Description |
|---|---|---|
| W2200BP | ADS Core | Provides essential RF and microwave design capabilities in a highly productive enterprise schematic design environment. Fast linear simulation, comprehensive filter and passive circuit synthesis. |
| W2302EP | Transient Convolution and Channel Simulation Element | Advanced time-domain simulator that includes High-Frequency SPICE simulation, Convolution and Channel Simulation for high-speed serial links using netlists, IBIS & IBIS-AMI models. Additionally includes Signal Integrity verification toolkit, and the Broadband SPICE model generator utility. |
| W2307EP | Interconnect Toolbox Element | The Interconnect Toolbox Element enables you to optimize your PCB stack up and design transmission line geometry. It also provides a high accuracy via design simulator which helps you to design a parameterized, impedance-matched via transition (single-ended and differential). |
To learn more about the products listed in the table above, click the Options & Accessories tab above to view Related Software Products.
