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Preço para o: Brasil

* Os preços não incluem impostos ou taxas, os quais deverão ser considerados na oportunidade em que emitida a cotação formal, conforme determinação das autoridades governamentais competentes. Os preços mostrados são os preços de varejo sugeridos pelo fabricante (MSRP). Os preços apresentados não incluem impostos.

Principais recursos e especificações

Electromagnetic Professional (EMPro) 2009 provides:

Superior three-dimensional electromagnetic (3D EM) circuit design flow integration which eliminates errors and delays from re-entering designs, setting up simulations and manual translations.

The most efficient 3D EM design environment for creating parameterized 3D components for use in circuit simulation and optimization.

Both finite element method (FEM) and finite-difference time-domain (FDTD) solvers integrated in a single platform to cover the broadest range of applications and cross-validation between frequency- and time-domain solvers to ensure the highest confidence in 3D EM simulation.

Descrição

Electromagnetic Professional 2009

Electromagnetic Professional (EMPro) 2009 is a 3D EM design platform that integrates with Advanced Design System (ADS) to streamline the circuit design flow. EMPro is especially important for circuit designers who require 3D EM simulation tools for designing RF System-in-Package (SiP), Monolithic Microwave Integrated Circuit (MMIC), package, module and laminates.

Facing Todays Design Challenges

In today's challenging design world, engineers can spend excessive amounts of time and experience multiple errors due to disconnected product and platform workflows. This frustration can include problems related to learning separate tools, re-drawing designs, re-entering material parameters and/or multiple simulation setups including assigning ports, boundary conditions & manual data integration.

E Field Plot

EMPro 2009's 3D EM circuit design flow intergation with ADS enables you to produce efficient and accurate designs that include packaging, chip-to-board transitions such as bond wires and solder bumps, antennas with tunable matching circuits, connectors and transitions, low temperature co-fired ceramic (LTCC) circuits, and more.

3D EM Design Showing Solder Bumps

EMPRo 2009 Features

Some of the unique features of EMPro 2009 include:

  • Integration with ADS, the industry’s leading circuit design platform.
  • The ablility to validate antenna compliance with industry and safety standards such as specific absorption ratio (SAR), hearing-aid compatibility (HAC), and multiple-input, multiple-output (MIMO).
  • Availability from the same vendor (Keysight Technologies) as the circuit design platform.
  • Lower cost, yet offers a better design flow.
  • The industry’s most modern, intuitive and efficient 3D EM platform.
  • Provided by the developers of Momentum, the gold standard in 3D planar EM.
  • On a fast-track delivery to an aggressive vision over the last three years and will continue to do so going forward.

Quad flat no-lead mesh

"It's about the flow with EMPro."

If you are ready to get started using EMPro, click Trials & Licenses > Details & Download > Request Free Trial License.

Looking for another version? View other EMPro Product Versions.