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Lead-Free Test and Inspection

Industry Challenges

Ready or not, the world of printed circuit board (PCB) manufacturing is facing major upheaval with a mandated shift to lead-free processes. Effective July 1, 2006, printed circuit board assemblies (PCBAs) sold in Europe and China are required by law to be 100% lead-free.

The size of those two markets and the global nature of manufacturing means that virtually all PCBA manufacturers need to be converted to lead-free processes within two years. The shift will not be clean: some products are exempted from the 2006 deadline; some products will have a mixture of lead and lead-free for years; some components will soon be available only in lead-free.

The shift to lead-free brings challenges to PCBA manufacturing, including potentially higher defect levels, shifting defect spectra, and fewer allowed repair attempts due to higher temperatures. These and other problems are addressed with Keysight's PCB Test and Inspection Portfolio for Lead-Free Manufacturing.

Summary

Keysight's lead-free-ready solutions minimize risk when moving to lead-free

No one can make the transition worry-free, but with Keysight you can reduce risk in PCBA test and inspection with three key advantages:

  • End-to-end test coverage
    Only Keysight has a complete test portfolio that includes solder paste inspection, automated optical inspection (AOI), automated X-ray test, in-circuit test (ICT), and functional test.
  • Lead-free-ready today
    Keysight has long supported industry leaders who are developing new lead-free alloys and flux systems, manufacturing systems, and software and methodologies. Keysight test and inspection solutions have had years of validation with actual customers, and are already being used in lead-free processes with manufacturers worldwide.
  • Expertise
    Keysight engineers understand lead-free manufacturing and test strategy, and know how to make them complement each other. Keysight can provide information, knowledge and guidance for successful lead-free test strategy implementation, and make sure you build a complete lead-free process that meets your needs.

To learn more, request additional product information.

Keysight partners can help you achieve the best possible results from your test solution. View a list of Channel Partners and Solution Providers for Electronic Manufacturing.

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“Shotgunning”, a Bad Fit for Lead-Free Test
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test

Nota de aplicação 2015-07-14

PDF PDF 99 KB
Shotgunning: Not for Pb-Free - A proper test approach can reduce scrap from random repair methods.
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, November 2005.

Artigo 2005-12-05

PDF PDF 57 KB
Characterizing new soldering processes – An experimental methodology for process optimization
Written by Glen Leinbach and Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, July 2005

Artigo 2005-12-05

PDF PDF 65 KB
Overcoming Lower Wetting Forces of Lead-Free Alloys
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, March 2005.

Artigo 2005-12-05

PDF PDF 77 KB
Pb-Free’s Impacts on Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, January 2005.

Artigo 2005-12-05

PDF PDF 75 KB
Pb-Free PCB Finishes for ICT - New solders can mean new finishes. How to decide which is best.
Written by Stig Oresjo and Chris Jacobsen, Agilent Technologies. Article published in Circuits Assembly, September 2005.

Artigo 2005-12-05

PDF PDF 88 KB
Putting Pb-Free to the Test - Why AOI and SPI are vital to upfront process control and verification.
Written by Stig Oresjo, Thorsten Niermeyer & Stacy Johnson, Agilent Technologies. Article published in Circuits Assembly, May 2005.

Artigo 2005-12-05

PDF PDF 74 KB
Lead-Free Cost Savings Analysis
This cost-savings calculator shows savings when deploying test on lead-free, as well as VTEP cost savings when compared to TestJet.

Nota de aplicação 2005-09-09

XLS XLS 39 KB
Study and Recommendations Into Using Lead Free PCBs at In-Circuit Test
ICT relies on good contact between the test probe and test pad. On OSP boards, it is important that the stencil allows solder paste to be applied to testpoints.

Materiais promocionais 2005-06-09

PDF PDF 214 KB
Selcom Testimonial
Customer testimonial which discusses the advantages gained from using the Keysight Medalist Family of test and inspection systems.

Estudo de Caso 2005-03-14

WMF WMF 19.21 MB
Test and Inspection as Part of the Lead-free Manufacturing Process
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.

Nota de aplicação 2005-02-22

PDF PDF 421 KB
Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.

Artigo 2004-10-01

The Importance of Test and Inspection When Implementing Lead-Free Manufacturing
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.

Nota de aplicação 2004-08-20

PDF PDF 260 KB
Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.

Nota de aplicação 2004-08-08

PDF PDF 102 KB
CCGA Lead-Free Study
Reliability Testing and Data Analysis of an 1657CCGA (Ceramic Column Grid Array) Package with Lead-Free Solder Paste on Lead-Free PCBs (Printed Circuit Boards).

Materiais promocionais 2004-06-04

PDF PDF 480 KB