Brochures
Integrated RF Test Solution
Keysight Technologies and Marvin Test Solutions
PXI-based, high performance ATE for component, SOC and SIP test
The ongoing challenge for today’s semiconductor test engineers is to identify and create new test solutions that can achieve significantly lower Cost of Test and a smaller footprint while providing comparable features to proprietary ATE platforms. The PXI platform offers test engineers a flexible and cost-effective test solution for today’s mixed-signal/RF devices. Combining Marvin Test Solutions’ TS-960e PXI platform with Keysight Technologies’ RF instrumentation, customers can address a wide range of RF and mixed-signal devices for both wafer and packaged test. The TS-960e’s open architecture can accommodate the full range of Keysight’s RF PXI products, Marvin Test Solutions’ extensive line of digital test products, as well as thousands of available PXI and PXIe instruments. System software includes MTS’ ATEasy software suite which provides an integrated test executive and test development environment as well as the ICEasy Test Suite. Optionally, Keysight’s X series and VSA software can be integrated with ATEasy, automating measurement and signal analysis for a wide range of RF applications. The system can address a wide range of applications including: WLAN components and modules; Bluetooth components and modules; cellular products; power amplifiers; RF com[1]ponents; baseband devices; EW/RADAR and communications devices.
Integrated RF Test Solution
The test system is supplied with ATEasy and all instrument drivers, virtual instrument panels and a system self-test, as well as the ICEasy Test Suite which offers a com[1]prehensive set of software tools for device test development and characterization. ATEasy supports a wide variety of Windows- based APIs including ATEasy, LabVIEW, CVI, Microsoft and Borland C/C++, Microsoft Visual Basic, and Borland Delphi. Marvin Test Solutions’ TS-960e PXI platform, when combined with Keysight Technologies’ PXI RF instrumentation, offers a fully integrated test solution for RF and mixed-signal devices for both wafer and packaged test.
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