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Electronic devices undergo multiple rounds of testing during the manufacturing process, including wafer-level, module-level, and module burn-in tests. However, systems and materials wear out with continuous use and various situations such as varying electrical loads and temperature stresses that can lead to device failure. Therefore, failures are defined within specific bounds under specific tolerance limits in the manufacturer’s data sheet. Early failures may come from poor design or improper manufacturing.
Accelerated life tests subject units to higher-than-usual stress levels such as voltage, temperature, humidity, pressure, and loading in order to speed up the deterioration of materials and electronic components. This process enables test engineers to collect failure information more quickly. About 40% of microelectronic failures1 are reportedly due to temperature, which is the most critical factor in component failure. Burn-in is a screening technique in which you apply high voltage and temperature during a product life cycle’s early stage to remove latent defects. It is used for highly integrated circuit systems.
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