Column Control DTX
GaAs MMIC ESD, Bonding and Die Attach Methods

GaAs MMIC ESD, Bonding and Die Attach Methods

Application Notes

ESD Considerations

A GaAs IC can be destroyed electrically by a static (or other) discharge through the device. Therefore, it must be handled so these effects cannot occur. Normal electrostatic discharge (ESD) preventive measures should be incorporated into all aspects of the storage, handling, and assembly of these devices. Specific measures to be taken should include:

  • Anti–static storage trays and boxes if the ICs are kept in other than the Keysight Technologies, Inc. supplied shipping containers.
  • Grounded mats at work stations.
  • Ground straps for operators.
  • Static eliminators on compressed gas nozzles.
  • Common grounding of equipment, mats, straps, etc.
  • Wire bonding sequence should be designed to eliminate static discharges through chip.

In addition to ESD prevention measures, assembly equipment should be inspected for any power line transients that may couple into equipment that comes in contact with ICs.

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Column Control DTX