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Keysight 1GG5-6205
DC to 13.5 GHz Packaged Integrated GaAs Diode Limiter
Data Sheet
Features
Description
The 1GG5-6205 is a 13.5 GHz GaAs integrated diode limiter that can be used to protect sensitive RF circuits from excess RF power, DC transients, and ESD.
The circuit contains Planar– Doped–Barrier (PDB) diodes with integrated matching networks and is fabricated the Keysight Technologies, Inc. GaAs diode process. The barrier height of each diode element and the number of diode elements in each “stack” are optimized for low distortion when Pin < 15 dBm, while limiting transmitted power when Pin > 25 dBm.
Absolute maximum ratings
DC specifications/physical properties
RF specifications
Applications
The 1GG5-6205 can be used as an RF limiter, a Reverse Power Protection (RPP) device, and as an ESD and DC transient protector.
As a limiter, the incident power at 1 dB gain compression (P–1dB) is 26.5 dBm at 9 GHz, and drops to 25 dBm at 20 GHz.
As an ESD protection device, the 1GG5-6205 can protect ESD sensitive components, the degree of protection depending on the protected components characteristics. ESD damage level for the 1GG5-6205 by itself is greater than 6 kV (measured with an IEC801–2, 150 pF, 330 ohm contact ESD generator).
Biasing and Operation
The 1GG5-6205 needs no bias, and is symmetric.
Tape and Reel
The 1GG5-6205 component is available in tape and reel format See Figure 2 for tape and reel label.
Moisture Compatibility
Injection mold components are moisture-sensitive. The product is tested to the Moisture and Reflow Sensitivity Level as per IPC/Jedec J-STD-020 and must be mounted within 168 hours of opening the shipping container. Store and handle parts for reflow and for rework per IPC/Jedec J-STD-033B.
RoHS Compliance
This device is RoHS Compliant. This means the component meets the requirements of the European Parliament and the Council of the European Union Restriction of Hazardous Substances Directive 2011/65/EU, commonly known as RoHS. The six regulated substances are lead, mercury, cadmium, chromium VI (hexavalent), polybrominated biphenyls (PBB) and polybrominated biphenyl ethers (PBDE). RoHS compliance implies that any residual concentration of these substances is below the RoHS Directive’s maximum concentration values (MVC); being less than 1000 ppm by weight for all substances except for cadmium which is less than 100 ppm by weight.
Assembly Techniques
The QFN SMT package is compatible with industry standard solder-reflow attach processes.
Diodes are ESD sensitive. ESD preventive measures must be employed in all aspects of handling and assembly. Diode ESD precautions, handling considerations, and bonding methods are critical factors in successful diode performance and reliability. Keysight Technologies, Inc. Beam Lead Diode Bonding and Handling Procedures - Application Note, literature number 5991-3513EN provides basic information on these subjects.
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