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For the most part, electronics designers have not challenged the effectiveness of the in-circuit test (ICT) as the focal point of printed circuit board assembly (PCBA) test strategy for many electronics manufacturers. However, the supremacy of ICT on the manufacturing floor faces a growing threat as low-voltage differential signaling (LVDS) integrated circuits used for high-speed differential signaling and ball grid array (BGA) devices increase in popularity.
ICT capabilities will likely experience even more pressure as pin counts increase to try and keep up with Moore’s Law, which predicts that the number of transistors on an integrated circuit will double every two years.
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