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Ball Grid Array Joint Inspection Using X-ray as it relates to voids and the IPC-7095A specification
With the introduction of Lead-free solder, voiding within Ball Grid Array (BGA) joints is potentially a major issue. This article discusses the relationship to voiding, the IPC standard and Automated X-ray Inspection.

专访 2012-12-06

PDF PDF 105 KB
Results from 2007 Industry Defect Level and Test Effectiveness Studies
To select an optimal test strategy, good knowledge of defect levels and test effectiveness are two very important factors to include. This paper presents data from a 2007 study of 3.7 billion solder joints. Reprinted with permission from IPC.

文章 2008-05-21

PDF PDF 118 KB
Article reprint: Impact of Quad Flat No Lead Package (QFN) on Automated X-ray Inspection (AXI)
This paper discusses lack of industry specification for QFN inspection, how AXI methodology was improved to detect QFN solder joint defect, design for inspection and future work.

文章 2008-03-06

PDF PDF 1.63 MB
Xray Choices for SMT Manufacturing
In many cases, there is a complementary choice of automated 3D X-ray and off-axis 2D X-ray inspection. This article explores this concept. Published with kind permission from SMT

文章 2007-11-01

PDF PDF 188 KB
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
Quad Flat No-Lead (QFN) packages are increasingly used on printed circuit boards. The QFN solder joint is hidden from most types of optical inspection test. This paper discusses how X-ray inspection can effectivly detect QFN joint defects.

文章 2007-09-20

PDF PDF 486 KB
Test Strategy Tips and Tricks
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, July 2007.

文章 2007-09-01

PDF PDF 236 KB
CAD and Your Test System
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, November 2007.

文章 2007-08-11

PDF PDF 508 KB
Defect-Detection Strategies
Written by James Benson. Published with permission from Circuits Assembly, May 2007.

文章 2007-08-11

PDF PDF 985 KB
Evolving Packages Drive Test and Inspection
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, March 2007

文章 2007-08-11

PDF PDF 747 KB
Limited Access Testing
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, July 2007.

文章 2007-07-01

PDF PDF 137 KB
The Power of Real-Time and Remote Information
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, May 2007.

文章 2007-05-01

PDF PDF 147 KB
Coverage Increased on Through-Hole Components Using PTH2 Algorithm
The 5DX Automated X-ray Inspection plated through hole algorithm, PTH2, provides an increase in accuracy along with repeatability for heavily shaded devices.

内部通讯 2006-09-08

Pb-Free’s Impacts on Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, January 2005.

文章 2005-12-05

PDF PDF 75 KB
Selcom Evaluates Keysight 5DX and BGA Open Outlier Technology
Case study of Selcom success in detecting BGA opens using Keysight 5DX and oval pad designs

案例分析 2005-10-27

PDF PDF 319 KB
Selcom Testimonial
Customer testimonial which discusses the advantages gained from using the Keysight Medalist Family of test and inspection systems.

案例分析 2005-03-14

WMF WMF 19.21 MB
AXI Conquers Hidden Joint Defects
Written by Jeremy Jessen, Agilent Technologies. Published In SMT magazine, February 2005.

文章 2005-02-01

PDF PDF 134 KB
3D Techniques in SMT Test
By Malachy Rice, Ph.D, Stacy Johnson and Glen Leinbach, Agilent Technologies. Published by EE - Evaluation Engineering, February 2004.

文章 2004-09-28

Selcom Group Uses Integrated Test to Cut Costs and Increase Business
Selcom Group uses a combination of test technologies from Keysight to meet stringent cost, quality, and shipping targets, allowing Selcom to continue growing and thriving in a difficult worldwide economy.

案例分析 2003-10-24

PDF PDF 600 KB
Step-by-Step Series: Step 9 -Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Published in SMT, October 2003.

文章 2003-10-01

Selecting the Optimal Test Strategy
Written by Stig Oresjo, Agilent Technologies. Published in Circuits Assembly, July 2003.

文章 2003-07-01

AwareTest xi Case Study #3
This case study compares fault coverage of the current test strategy (automatic optical inspection/full in-circuit test) with a combined x-ray inspection/simplified in-circuit test strategy.

案例分析 2003-02-15

PDF PDF 164 KB
AwareTest xi Case Study #1
This case study compares a fully-probed in-circuit test on a conventional high node count test system with a combined x-ray/in-circuit test strategy, using the simplified in-circuit test.

案例分析 2003-02-15

PDF PDF 127 KB
AwareTest xi Case Study #2
This case study compares the current test strategy with a full combined test strategy and a simplified combined test strategy (x-ray inspection followed by simplified in-circuit test).

案例分析 2003-02-15

PDF PDF 763 KB
One Billion Solder Joints and Counting
Written by Stig Oresjo, Agilent Technologies. Published with permission from Circuits Assembly, February 2001.

文章 2003-02-01

PDF PDF 1.81 MB
Charting a DFT Course for Limited Access Boards
Written by Stig Oresjo and Barry Odbert. Published with permission from SMT Magazine, June 2002.

文章 2002-06-01

PDF PDF 143 KB

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