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Agilent's Newest SystemVue Software Release Accelerates MIMO Radar and Wireless/4G Design
Agilent announces the newest release of SystemVue, its premier platform for designing communications and defense systems.

プレス資料 2013-02-14

Agilent Technologies Commits $90 Million Gift of Software to Georgia Institute of Technology
Agilent announces the largest in-kind software donation ever in its longstanding relationship with the Georgia Institute of Technology.

プレス資料 2013-02-04

Agilent Technologies and SiSoft Introduce Pre-Standard IBIS-AMI Modeling Guide
Agilent and Signal Integrity Software, Inc. (SiSoft) announce guidelines that enable system designers to use advanced jitter and broadband analog capabilities when modeling high-speed serial devices.

プレス資料 2013-01-29

Leti and Agilent to Present Results on Millimeter-Wave Short-Range Communication Integrated Systems
CEA-Leti and Agilent Technologies will present their recent research results in the field of embedded integrated systems at the IEEE Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Conference in Austin, Texas, Jan. 21-23.

プレス資料 2013-01-18

Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling
Agilent announces the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP).

プレス資料 2012-12-18

MOS-AK/GSA Modeling Working Group Holds Winter Workshop in San Francisco
Experts Share Insight on Compact Device Modeling with Emphasis on Simulation-Aware Models.

プレス資料 2012-12-12

Agilent Ships New ADS Software to Further Advance Single-, Multi-Tech. Design of RF Power Amplifiers
Agilent announces shipment of Advanced Design System 2012.08, its flagship RF and microwave EDA software platform.

プレス資料 2012-12-05

Agilent Technologies Ships Newest GoldenGate Software Release for RFIC Designers
Agilent announces shipment of its GoldenGate 2012.10 RFIC simulation, verification and analysis software.

プレス資料 2012-11-16

Agilent Technologies Ships Newest EMPro Software Release for Analyzing 3-D Electromagnetic Effects
Agilent Technologies announces shipment of its EMPro 2012.09 3-D electromagnetic simulation software.

プレス資料 2012-11-15

Electrical Redriver Modeling Solution to Solve Key Challenges in Designing Chip-to-Chip Links
Agilent introduces a redriver modeling solution designed to quickly and accurately solve the challenge posed by signal distortion in multigigabit-per-second systems.

プレス資料 2012-11-05

Agilent Technologies to Demonstrate High-Speed Digital Design Solutions at EPEPS
Agilent announces it will demonstrate its high-speed digital design solutions at EPEPS 2013, Oct. Oct. 28 & 29, at the DoubleTree by Hilton Hotel in San Jose, Calif

プレス資料 2012-10-28

Agilent Technologies to Demonstrate Newest 3-D EM Software Release at European Microwave Week
Agilent announces that EMPro 2012 will be demonstrated at European Microwave Week (Booth 114), Oct. 29-Nov. 1, RAI, Amsterdam.

プレス資料 2012-10-23

Agilent to Demonstrate Newest Microwave and RF Design and Test Solutions at European Microwave Week
Agilent announces it will show its newest microwave and RF design, test and measurement solutions for the aerospace, defense, research, education, communications, transportation and medical markets at European Microwave Week (Booth 114), Oct. 29- 31, at the RAI convention center in Amsterdam.

プレス資料 2012-10-17

Murata Component Library released for Agilent Technologies' Genesys
Murata Manufacturing Co. Ltd. announces their release of a component library for Agilent's Genesys software.

プレス資料 2012-10-10

Agilent Technologies Unveils ADS 2012 Software
Agilent unveils ADS 2012, the next major release of its Advanced Design System (ADS) flagship RF and microwave EDA platform.

プレス資料 2012-10-03

Agilent's EMPro Selected by STMicroelectronics for ESD Development in 40-nm IC Products
Agilent announces that STMicroelectronics has selected EMPro software for use in development of ESD structures based on advanced CMOS process technology.

プレス資料 2012-10-02

STATS ChipPAC Launches QFN Package Design Kit for Agilent Technologies’ Advanced Design System
STATS ChipPAC announces the launch of its Quad Flat No-Lead (QFN) package design kit for ADS.

プレス資料 2012-09-12

Zuken Announces Enhanced Integration of Board Designer with Advanced Design System
Zuken, a leader in PCB Systems and IC Package design, announces enhancements to its integration between Zuken’s Board Designer solution and Agilent's Advanced Design System (ADS) software.

プレス資料 2012-08-30

Agilent Technologies Ships New Software for Generating and Qualifying SPICE Models
Agilent today announced shipment of its first release of the industry-leading SPICE modeling tools it obtained through the acquisition of Accelicon Technologies in February.

プレス資料 2012-08-23

Agilent to Demonstrate Test Solutions at International Symposium on Electromagnetic Compatibility
Agilent will demonstrate its test solutions at the IEEE International Symposium on Electromagnetic Compatibility in Pittsburg, Aug. 5-10, 2012.

プレス資料 2012-07-18

Aldec and Agilent Technologies Bridge the Gap Between ESL and RTL by Linking Simulation Environments
This new solution enables users to efficiently integrate algorithm and system-level designs with hardware implementations.

プレス資料 2012-07-10

Agilent Technologies Collaborates with Thales to Apply X-parameters* Technology to RF System Design
Agilent announces that its ongoing collaboration with Thales, a global technology leader for the defense and security and the aerospace and transport markets, has expanded the reach of X-parameters technology to wideband super-heterodyne receiver applications.

プレス資料 2012-06-20

Agilent Extends Partnership with AMCAD to Include Nonlinear Modeling and Measurement Services
Agilent announces that its long-term relationship with AMCAD Engineering has been extended to include a technology partnership for services related to nonlinear design and measurement of new electronic devices.

プレス資料 2012-06-19

Advanced Design System Selected by Sivers IMA for Front-to-Back Silicon RFIC Implementation
Agilent announces that Sivers IMA, a leading European manufacturer of microwave products for telecommunications, industrial, and test and measurement applications, has selected ADS 2011 EDA platform for complete silicon-based RFIC/MMIC implementation.

プレス資料 2012-06-19

IBM adds back-end PDK support for Agilent Technologies’ Advanced Design System Software
IBM announces the availability of a full front-to-back PDK for its popular SiGe BiCMOS 8HP technology. The PDK was developed for use with ADS 2011 and enables both IBM and Agilent customers to take full advantage of the industry’s most comprehensive RF and microwave design platform.

プレス資料 2012-06-18

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