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Power Amplifier Design for LTE
Using Agilent Genesys software to speed RF and microwave board designs for circuits and subsystems

Seminar Materials 2010-03-18

PDF PDF 5.61 MB
How to Prevent MMIC/RFIC Packaging Integration Failures

Seminar Materials 2010-03-04

PDF PDF 2.99 MB
Mixer Design for LTE
Using Agilent Genesys software to speed RF and microwave board designs for circuits and subsystems

Seminar Materials 2010-01-14

PDF PDF 5.86 MB
Filter Design for LTE
Genesys "How-To-Design" Part 2 of 6

Seminar Materials 2009-11-19

PDF PDF 1.85 MB
60GHz Power Amplifier Design for Wireless HDMI
Recorded webcast presented by Michael Thompson, Applications Engineer, Agilent Technologies.

Seminar Materials 2009-10-13

Receiver Design for LTE
Genesys "How-To-Design" Part 1of 6

Seminar Materials 2009-09-17

PDF PDF 8.15 MB
MMIC/RFIC Packaging Challenges Slides
These slides cover several applications including the Agilent custom TOPS package, Agilent QFN package, solder bumps for FC package, Balun & mixer IC module, and RFIC PA co-design.

Seminar Materials 2009-08-26

PDF PDF 3.79 MB
Agilent Wireless Test & Design World 2009 in Seoul, Korea
Agilent EEsof EDA related materials presented at the Agilent Wireless Test & Design World 2009

Seminar Materials 2009-07-01

2009 ADS Users' Group Meeting
Agilent ADS User Group Meeting

Seminar Materials 2009-06-18

Serial ATA (SATA) Revision 3.0 PHY Testing Challenges: Verify your 6Gbps design to the spec [5122]

Training Materials 2009-05-13

CDMA Basics
This course provides technicians with a fundamental understanding of CDMA technology.

Classroom Training

Debugging and Characterization of Embedded PCI Express® Applications

Training Materials 2009-04-16

Ensuring Interoperability And Performance Of Your DDR Memory Subsystem

Training Materials 2009-04-07

EM Insights Series Episode #5: BGA Package Simulation
An Agilent Technologies Presentation (EM Insights Series, Episode #5) describes BGA package simulation in detail.

Seminar Materials 2009-03-31

PDF PDF 620 KB
EM Insights Series Episode #2: Single and Multiple Band Microstrip Planar Array Antenna
An Agilent Technologies Presentation (EM Insights Series, Episode #2) decribes single (C Band) and multiple band (C and X band) microstrip planar array antenna in detail.

Seminar Materials 2009-03-30

PDF PDF 1.06 MB
EM Insights Series Episode #1: QFN Package
An Agilent Technologies Presentation (EM Insights Series, Episode #1) decribes QFN Package in detail.

Seminar Materials 2009-03-27

PDF PDF 1.32 MB
Solving High-Speed DDR SI and Probing Challenges

Training Materials 2009-01-13

Tips to Debugging DDR 1, 2 and 3 Physical and Protocol Layer Issues webcast

Training Materials 2009-01-06

A New Circuit Design Methodology for CMOS Transceiver LSI Designs, using Agilent GoldenGate
A Toshiba Case Study from the Agilent EDA Forum 2008.

Seminar Materials 2008-12-18

PDF PDF 1.89 MB
X-Parameters

Seminar Materials 2008-12-15

Advances in Millimeter Wave Measurements

Training Materials 2008-09-01

PPS PPS 4.03 MB
Advances in EM Modeling for Circuit Designers
Agilent has integrated the planar 3D EM tool from ADS - Momentum, into the easy to use, affordable Genesys platform. Agilent has also introduced EMDS, an affordable full 3D EM simulator.

Seminar Materials 2008-06-17

PDF PDF 3.05 MB
Digitizing Oscilloscope Fundamentals
This class gives the student an in-depth understanding of the operation and measurement techniques with an Infiniium oscilloscope.

Classroom Training

How to Solve DDR Signal Integrity Validation Challenges
How to Solve DDR Signal Integrity Validation Challenges

Training Materials 2008-02-13

Presentation on Design Techniques for First Pass RF Board Design
This Presentation highlights simulation methods using Agilent Genesys and Momentum GX, Key design choices and techniques for implementation and design examples (amplifiers, and antennas).

Seminar Materials 2008-01-10

PDF PDF 2.28 MB

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