这是我们认为您想要浏览的网页。 查看搜索结果:

 

与专家交流

技术支持

电子测量

按产品型号支持:

1-25 / 113

排序:
Global EMS Manufacturer Reduces Time to Market Using PathWave Manufacturing Analytics - Case Study
The real time automated result analysis and anomaly detection in Keysight’s PathWave Manufacturing Analytics reduce engineering time and effort significantly, empowering the EMS company to release the product into the market sooner.

案例分析 2019-06-04

PDF PDF 2.09 MB
Quadruples throughput with i3070 4-Module In-Circuit Inline in Automotive Electronics Manufacturing
An Automotive Electronics Manufacturing increases the test throughput more than 50% by using i3070 4-Module Inline In-Circuit System with Dual Board Staging and Throughput Multiplier feature.

案例分析 2019-05-22

PDF PDF 4.96 MB
Head-to-Head Comparison - Vectorless Test: NanoVTEP vs VTEP - Case Study
This case study summarizes some of the results of early tests conducted at customer sites, and includes results of controlled tests conducted in Keysight’s R&D lab.

案例分析 2018-06-05

PDF PDF 3.39 MB
是德科技 边界扫描测试的缺陷范围: 通过边界扫描测试意味着什么 ?
是德科技 边界扫描测试的缺陷范围: 通过边界扫描测试意味着什么 ?

文章 2017-11-27

PDF PDF 1.16 MB
Keysight Medalist i3070 系列 5 与其前代产品 i3070 在线测试系统 吞吐率比较 — 生产线案例研究
Keysight Medalist i3070 系列 5 与其前代产品 i3070 在线测试系统 吞吐率比较 — 生产线案例研究

案例分析 2017-11-27

PDF PDF 713 KB
是德科技 测试范围: 通过电路板测试时意味着什么?
是德科技 测试范围: 通过电路板测试时意味着什么?

文章 2017-11-27

PDF PDF 866 KB
Mini ICT with VTEP Accurately Detects Solder Failure on SMT Connector - Case Study
Find out how one customer reported reduction in bone pile and significant savings on scrap cost after using the Mini ICT systems with VTEP

案例分析 2017-07-24

PDF PDF 779 KB
i3070 Inline ICT Improves Functional Test Yield of SSDs - Case Study
Find out how one customer reported first pass yield results of more than 95% with less than 0.5% false failures, after installing the i3070 Series 5 Inline ICT systems.

案例分析 2017-07-10

PDF PDF 610 KB
Early Design Review or Boundary Scan in Enhancing Testability and Optimazation of Test Strategy
With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs.

文章 2017-05-08

PDF PDF 624 KB
Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of PCBA
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a components/devices in a Printed Circuit Board Assembly (PCBA)

文章 2017-04-01

PDF PDF 860 KB
Rehost Service for Keysight ICT, AXI and AOI systems
Rehost service is included as part of Keysight support agreement for hardware support or software subscription service.

专访 2016-11-10

Testing a Network Communication PCBA from Prototype to Manufacturing - Article Reprint
Early implementation of BST can cut test costs and time.

文章 2016-02-17

PDF PDF 178 KB
The Boundary Scan Toolbox - Article Reprint
Find out how boundary scan can enable embedded and other value-added test in your toolbox.

文章 2016-02-16

PDF PDF 409 KB
New IEEE Standards for Board and System Tests - Article Reprint
This article highlights of changes to IEEE Std 1149.1, IEEE Std 1149.6, IEEE P1149.10 and IEEE P1838.

文章 2016-02-16

PDF PDF 190 KB
ABCs of Writing a Custom Boundary Scan Test - Article Reprint
This article provides sample vectors and code for expanding test coverage with boundary scan.

文章 2016-02-12

PDF PDF 472 KB
I'm a Board Test Engineer and I'm Loving It! - Article Reprint
Life on the road can be relentless, but it’s never boring. Find out why from this personal story of a test engineer.

文章 2016-02-12

PDF PDF 178 KB
Manufacturing Test Solutions for SSDS - Article Reprint
A new system performs both ICT and boundary scan in high-volume settings.

文章 2016-02-09

PDF PDF 222 KB
Testing the Internet of Things - Article Reprint
Connectivity is embedded in the electronics ecosystem. And test should be embedded in the devices that support it.

文章 2016-02-09

PDF PDF 79 KB
Tester for Hire - Article Reprint
This article explores the possibility of renting test equipment to help electronics manufacturers juggle capacity according to production demand and available resources.

文章 2016-02-09

PDF PDF 381 KB
The Flash Programming Flow - Article Reprint
On-board flash memory device testing and programming.

文章 2016-02-05

PDF PDF 251 KB
Testing of Small Form-Factor Products - Article Reprint
Boundary scan and embedded test will need to make up for ICT gaps.

文章 2016-02-03

PDF PDF 546 KB
Making Boundary Scan Easy - Article Reprint
Testing boundary scan devices no longer need be a laborious task.

文章 2016-02-03

PDF PDF 217 KB
Automating In-Circuit Test - Article Reprint
Inline ICT is not as cumbersome as it used to be, and in the longer run, will help manufacturers save costs.

文章 2016-02-02

PDF PDF 87 KB
Keysight Vectorless Test EP (VTEP) 与 Keysight TestJet 相比
Keysight Vectorless Test EP (VTEP) 与 Keysight TestJet 相比

案例分析 2015-12-22

PDF PDF 1 MB
Principal Component Analysis-Based Compensation for Measurement Errors
This paper examines some issues and trends that justify adding features to IEEE 1149.1 that will facilitate safe, fast and effective initialization of a board or system, to get it ready for testing. Published with kind permission of the IEEE

文章 2015-06-08

PDF PDF 1.86 MB

1 2 3 4 5 下一页