Here’s the page we think you wanted. See search results instead:


Contact an Expert

Innovations in EDA: IC, Laminate, Package Multi-Technology PA Module Design Methodology

1   Hour | Webcast - recorded | Where & When


Today's RF and Microwave designers are confronted with challenging requirements. Designers must design complex ICs in multi-chip RF modules with multiple technologies. This requires the IC's, package, laminate, and PCB to be designed together where EM interactions between components and substrates can be accurately modeled. This task is best performed in a simplified integrated design flow.

This webcast will detail an effective solution to these challenges and will present recent advances and breakthrough capabilities in ADS 2012 for today's challenging multi-technology co-design in RF modules and System-in-Package (SiP). Various examples will be presented in order to clearly illustrate these new capabilities.


Engineering Designers, Managers, and EDA tool decision makers involved in a design team responsible for developing Multi-Technology RF designs for the latest commercial wireless or Aerospace-Defense applications.


Jack Sifri - MMIC Design Flow Specialist, Agilent Technologies

Jack Sifri is the MMIC Design-Flow Specialist and Product Manager of MMIC simulation technologies at Agilent EEsof EDA. Before joining Keysight, Jack had 14 years of experience in designing RF and Microwave circuits for space applications at Hughes Aircraft Co. Jack has published many articles on LNA Design Techniques, MMIC and Statistical Design Methodology and Design for Manufacturing, Non-Linear X-Parameters, and on-Circuit Simulation Technologies. Jack holds a bachelor degree and a masters degree in Electrical Engineering from the University of California at Los Angeles, and an MBA degree from the University of Southern California.

Where & When

Price Location For more information
Free At Your PC Enroll to view the August 2, 2012 recorded broadcast 

Prices shown are list prices and are subject to change without notice.

Training & Event Materials

IC, Laminate, Package Multi-Technology PA Module Design Methodology 
Innovations in EDA Webcast on realizing the multi-technology vision within a fully integrated design flow in Advanced Design System.

Seminar Materials 2014-10-15