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SI/PI PCB Design Considerations for Thermal Webcast

1   小時 | 網路廣播 -- 存檔 | 地點與時間

Typically signal integrity (SI) and power integrity (PI) engineers set or assume the temperature for analysis at room temperature. However, the temperature may be higher than that, depending on the DUT location on PCB. What thermal effects for SI and PI do we anticipate if the PCB temperature is high? In this webcast, we will review the thermal effects on your PCB designs and demonstrate the performance changes due to the temperature change based on a practical case study.

PRESENTER

Hee-Soo Lee, 3D EM Applications Specialist, Keysight EEsof EDA

Hee-Soo Lee holds a BSEE degree from the Hankuk Aviation University, Korea. He has more than 20 years of design and simulation experience in the area of RF and Microwave designs, and is currently the Applications Specialist for 3D EM solutions at Keysight EEsof EDA.

地點與時間

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免費 At Your PC Enroll to view the January 25, 2018 recorded broadcast 

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教育訓練與活動資料

SI/PI PCB Design Considerations for Thermal Webcast Slides 
Slides from the January 25, 2018 webcast

研討會講義 2018-01-25

PDF PDF 3.21 MB