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Demystifying Vias in High-Speed PCB Design Webcast

1   Hour | Webcast - Registrato | Where & When


In PCB designs, vias are virtually everywhere and come in various types, whether signal, ground, or thermal vias, as well as through-hole, blind, and buried vias for manufacturing technology. There are even single-ended or differential vias for signaling purpose. No matter how the vias are classified, it is important to note that they play an important role in the PCB, especially in high-speed designs.

This webcast discusses the basics of high speed PCB via designs such as via pads, anti-pads, return currents, stubs, and crosstalk using electrical and Electro-Magnetic (EM) modeling approaches.


PCB designers wanting to gain a greater knowledge of vias and how to properly utilize them in PCB design.


Hee-Soo Lee, 3D EM Applications Specialist

Hee-Soo Lee holds a BSEE degree from the Hankuk Aviation University, Korea. He has more than 20 years of design and simulation experience in the area of RF and Microwave designs, and is currently the Applications Specialist for 3D EM solutions at Keysight EEsof EDA

Where & When

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Free At Your PC Enroll to view the March 23, 2017 recorded broadcast 

Prices shown are list prices and are subject to change without notice.