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Advanced EM in ADS in Germany (Munich)

Join us for 3 Learning Days in Germany next April 21, 22, 23 2015!

For users of ADS with a thorough understanding of the layout environment and who have learned the fundamentals of Momentum simulations, meshing, Momentum RF and Momentum Microwave, and the common EM GUI for MoM and FEM (topics covered in the 3 day ADS Fundamentals class), this 3 day class allows them to expand their knowledge into the advanced and powerful capabilities built on top of the basic infrastructure. These important capabilities, some of them unique amongst all the modern RF/microwave simulators, are necessary for almost any complex designs found in modern circuits. By attending these classes, you will significantly bootstrap yourself into proficient understanding and usage of the below described topics. The huge return on this small investment has been confirmed by 100’s of customers over the past years.

Detailed agenda:

EM Component Parameterization, Cosimulation & Cooptimization
EM Component parameterization is the basis for EM-circuit-system cooptimizations. Learn the two methods to convert static to parameterized geometries – Nominal/Perturbed graphical and Subcircuit component based. Compare traditional “puzzle-piece” modeling approaches to modeling an entire geometry in a single EM simulation. Understand and efficiently use thick conductor modeling using LTCC spiral inductors as examples. For custom geometries with complex parameterization requirements, learn how to define AEL artwork macros and convert them to EM Components.

Efficient CPW & Multilayer Modeling & Analysis of Differential Structures
Use slot layers to efficiently model (CPW) Coplanar Waveguide and multilayer PCB structures. Learn the different grounding concepts such as localized grounds and return paths vs. ground at infinity, and differential signaling. Perform pure differential and mixed-mode (common–differential) S Parameter simulations using schematic templates and DDS equations and understand the implications this has on real world differential signal routing.

Multitechnology Structures, IC Packaging, Modules, SiP
The Finite Element Method is the most general 3D simulation technique and allows users to simulate IC or multi-chip module packages and many other structures that Momentum cannot represent. FEM can also be used to validate Momentum simulations to increase confidence levels. In this class, you will also learn why building 3D models from a 2D layout user-interface has significant benefits over having to draw 3D structures in a CAD UI.

Where & When

Price Date(s) Location For more information
EUR 490 per day 2015-04-21 09:00 - 2015-04-23 17:00
Local Time
Techcom Training Center, Bajuwarenring 12a
82041 Oberhaching, Germany